NUP3115UPMU
Transient Voltage
Suppressors
Low Capacitance ESD Protection for
High Speed Data
The three−line voltage transient suppressor array is designed to protect
voltage−sensitive components that require ultra−low capacitance from
ESD and transient voltage events. This device features a common anode
design which protects three independent high speed data lines and a V
CC
power line in a single six−lead UDFN low profile package.
Excellent clamping capability, low capacitance, low leakage, and fast
response time make these parts ideal for ESD protection on designs
where board space is at a premium. Because of its low capacitance, it is
suited for use in high frequency designs such as a USB 2.0 high speed.
Features
http://onsemi.com
D
1
D
2
D
3
V
CC
6.8V
16V
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Low Capacitance 0.8 pF
UDFN Package, 1.6 x 1.6 mm
Low Profile of 0.50 mm for Ultra Slim Design
Stand Off Voltage: 5.5 V
Low Leakage
Protects up to Three Data Lines Plus a V
CC
Pin
V
CC
Pin = 15 V Protection
D
1
, D
2
, and D
3
Pins = 6.4 V Minimum Protection
IEC61000−4−2: Level 4 ESD Protection
This is a Pb−Free Device
USB 2.0 High−Speed Interface
Cell Phones
MP3 Players
SIM Card Protection
MARKING
DIAGRAM
6
1
P3
M
G
UDFN6 1.6x1.6
MU SUFFIX
CASE 517AP
1
P3 MG
G
= Specific Device Code
= Date Code
= Pb−Free Package
(Note: Microdot may be in either location)
Typical Applications
PIN CONNECTIONS
D
1
1
D
2
2
D
3
3
Unit
A
°C
°C
°C
V
GND
6
5
4
V
CC
NC
NC
MAXIMUM RATINGS
(T
J
= 25°C, unless otherwise specified)
Symbol
I
PK
T
J
T
STG
T
L
ESD
Rating
Peak Pulse Current
V
CC
Diode
8x20
msec
double exponential waveform
Operating Junction Temperature Range
Storage Temperature Range
Lead Solder Temperature – Maximum
(10 seconds)
IEC 61000−4−2 Contact
Value
5.0
−40
to 125
−55
to 150
260
8000
ORDERING INFORMATION
Device
NUP3115UPMUTAG
Package
Shipping
†
UDFN6 3000/Tape & Reel
(Pb−Free)
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
See Application Note AND8308/D for further description of
survivability specs.
©
Semiconductor Components Industries, LLC, 2009
September, 2009− Rev. 1
1
Publication Order Number:
NUP3115UPMU/D
ONSEMI [ ON SEMICONDUCTOR ]
