SS26
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance
−
Junction−to−Lead (Note 1)
Thermal Resistance
−
Junction−to−Ambient (Note 2)
1. Mounted with minimum recommended pad size, PC Board FR4.
2. 1 inch square pad size (1 x 0.5 inch for each lead) on FR4 board.
Symbol
R
qJL
R
qJA
Value
24
80
Unit
°C/W
ELECTRICAL CHARACTERISTICS
Value
Characteristic
Maximum Instantaneous Forward Voltage (Note 3)
(i
F
= 1.0 A)
(i
F
= 2.0 A)
(V
R
= 60 V)
Symbol
v
F
T
J
= 25°C
0.51
0.63
0.2
T
J
= 125°C
0.475
0.55
10
Unit
V
Maximum Instantaneous Reverse Current (Note 3)
3. Pulse Test: Pulse Width
≤
250
ms,
Duty Cycle
≤
2.0%.
I
R
mA
10
I
F
, INSTANTANEOUS FORWARD
CURRENT (A)
75°C
125°C
25°C
10
I
F
, INSTANTANEOUS FORWARD
CURRENT (A)
125°C
75°C
25°C
1
1
0.1
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.1
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
V
F
, INSTANTANEOUS FORWARD VOLTAGE (V)
V
F
, INSTANTANEOUS FORWARD VOLTAGE (V)
Figure 1. Typical Forward Voltage
Figure 2. Maximum Forward Voltage
1.0E−02
125°C
I
R
, REVERSE CURRENT (A)
100
25°C
f = 1 MHz
C, CAPACITANCE (pF)
10
0
1.0E−03
1.0E−04
1.0E−05
25°C
1.0E−06
1.0E−07
75°C
0
10
20
30
40
50
60
10
20
30
40
50
60
V
R
, REVERSE VOLTAGE (V)
V
R
, REVERSE VOLTAGE (V)
Figure 3. Typical Reverse Current
Figure 4. Typical Capacitance
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