Plastic Infrared Emitting Diode
OP290 Series
Absolute Maximum Ratings
(T
A
=25°C unless otherwise noted)
Storage and Operating Temperature Range
Reverse Voltage
OP290, OP292, OP294, OP295, OP297, OP299
OP291, OP293, OP296, OP298
Continuous Forward Current
OP290, OP291, OP292
OP294, OP295, OP299
OP295, OP296, OP297
Continuous Forward Current, OP293, OP298
Free Air
Board Mounted
Full Heat Sink
Peak Forward Current
OP290, OP295 (25 µs pulse width)
OP291, OP296 (100 µs pulse width)
OP292, OP297 (100 µs pulse width)
OP293, OP298 (25 µs pulse width)
OP294, OP299
-40
o
C to +100
o
C
5.0 V
2.0 V
150 mA
(1)
100 mA
(1)
150 mA
(1)
100 mA
133 mA
200 mA
5.0 A
2.0 A
1.00 A
2.0 A
750 mA
Notes:
1. For OP290, OP291, OP292, OP295, OP296 and OP297, derate linearly 1.67 mA/° C above 25° C (free-air). When used with heat
sink (see note 5), derate linearly 2.07 mA/° C above 65° C (normal use). For OP293 and OP298, when measured in free-air, derate
power dissipation linearly 1.43 mW/° C above 25° C. For OP294 and OP299, derate linearly 1.80 mW/° C above 25° C.
Absolute Maximum Ratings
(T
A
=25°C unless otherwise noted)
Maximum Duty Cycle
OP290 (25 µs pulse width @ 5 A)
Lead Soldering Temperature [1/16 inch (1.6 mm) from case for 5 seconds with soldering iron]
Power Dissipation, Free Air
OP290, OP291, OP292, OP295, OP296, OP297
OP293, OP298
Power Dissipation, Board Mounted
OP290, OP291, OP292, op295, OP296, OP297
OP293, OP298
Power Dissipation, Full Heat Sink
OP290, OP291, OP292, OP295, OP296, OP297
OP293, OP298
Power Dissipation
OP294, OP299
1.25%
(1)
260° C
(2)
333 mW
(3)
142 mW
(3)
533 mW
(4)
200 mW
(4)
1.11 W
(5)
400 mW
(5)
180 mW
Notes:
1. For OP290, OP291, OP292, OP295, OP296 and OP297, refer to graph of Maximum Peak Pulse Current vs Pulse Width.
2. For all OPs in this series, RMA flux is recommended. Duration can be extended to 10 second maximum when soldering. A
maximum of 20 grams force may be applied to the leads when flow soldering.
3. For OP290, OP291, OP292, OP295, OP296 and OP297, measured in free-air. Derate linearly 3.33 mW/° C above 25° C.
4. For OP290, OP291and OP292, mounted on 1/16” (1.6 mm) thick PCBoard with each lead soldered through 80 mil square lands
0.250” (6.35 mm) below flange of device. Derate linearly 5.33 mW/°C above 62.5°. For OP293 and OP298, mounted on 1/16” (1.60
mm) thick PCBoard with each lead soldered through 80 mil square lands 0.250” (6.35 mm) below flange of device. Derate power
dissipation linearly 2.00 mW/°C above 25° C (normal use). For OP295, OP296 and OP297, mounted on 1/16” (1.6 mm) thick
PCBoard with each lead soldered through 80 mil square lands 0.250” (6.35 mm) below flange of device. Derate linearly 5.33 mW/°C
above
25° C.
5. Immersed in silicone fluid to simulate infinite heat sink. For OP290, OP291 and OP292, derate linearly 11.1 mW/°C above 95°C. For
OP293 and OP298, derate power dissipation linearly 2.50 mW/° C above 25° C. For OP295, OP296 and OP297, derate linearly 11.1
mW/° C above 25° C.
OPTEK reserves the right to make changes at any time in order to improve design and to supply the best product possible.
OPTEK Technology Inc. —
1645 Wallace Drive, Carrollton, Texas 75006
Phone: (972) 323-2200 or (800) 341-4747
FAX: (972) 323-2396 sensors@optekinc.com www.optekinc.com
Issue A
05/07
Page 3 of 8
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