OXmPCI952
OXFORD SEMICONDUCTOR LTD.
8.3.7
8.3.8
8.3.9
8.3.10
8.3.11
ECP DATA FIFO ........................................................................................................................................................... 76
TEST FIFO.................................................................................................................................................................... 76
CONFIGURATION A REGISTER ................................................................................................................................. 76
CONFIGURATION B REGISTER ................................................................................................................................. 76
EXTENDED CONTROL REGISTER ‘ECR’................................................................................................................... 77
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SERIAL EEPROM................................................................................................................................78
SPECIFICATION............................................................................................................................................................... 78
ZONE 0: HEADER ........................................................................................................................................................ 79
ZONE 1: LOCAL CONFIGURATION REGISTERS....................................................................................................... 80
ZONE 2: IDENTIFICATION REGISTERS..................................................................................................................... 81
ZONE 3: PCI CONFIGURATION REGISTERS ............................................................................................................ 81
9.1
9.1.1
9.1.2
9.1.3
9.1.4
9.1.5
9.1.6
9.1.7
ZONE 4 : POWER MANAGEMENT DATA
(AND DATA_SCALE ZONE)............................................................. 82
ZONE 5 : FUNCTION ACCESS.................................................................................................................................... 82
MINIMUM PROGRAMMING REQUIREMENTS. .......................................................................................................... 83
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OPERATING CONDITIONS.............................................................................................................84
10.1 DC ELECTRICAL CHARACTERISTICS .......................................................................................................................... 84
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AC ELECTRICAL CHARACTERISTICS..........................................................................................86
11.1 PCI BUS ............................................................................................................................................................................ 86
11.2 LOCAL BUS...................................................................................................................................................................... 86
11.3 SERIAL PORTS ................................................................................................................................................................ 88
12
13
TIMING WAVEFORMS.....................................................................................................................89
PACKAGE INFORMATION............................................................................................................ 104
13.1 160-PIN LQFP PACKAGE.............................................................................................................................................. 104
13.2 176-PIN BGA PACKAGE................................................................................................................................................ 105
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ORDERING INFORMATION .......................................................................................................... 106
DS-0020 Jun 05
Page 5
OXFORD [ OXFORD SEMICONDUCTOR ]
