R8C/28 Group, R8C/29 Group
SINGLE-CHIP 16-BIT CMOS MCU
REJ03B0169-0110
Rev.1.10
May 17, 2007
1.
Overview
These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series
CPU core, and are packaged in a 20-pin molded-plastic LSSOP. It implements sophisticated instructions for a high
level of instruction efficiency. With 1 Mbyte of address space, they are capable of executing instructions at high speed.
Furthermore, the R8C/29 Group has on-chip data flash (1 KB × 2 blocks).
The difference between the R8C/28 Group and R8C/29 Group is only the presence or absence of data flash. Their
peripheral functions are the same.
1.1
Applications
Electronic household appliances, office equipment, audio equipment, consumer products, automotive, etc.
J and K versions are under development. Specifications may be changed without prior notice.
Rev.1.10 May 17, 2007
REJ03B0169-0110
Page 1 of 67
RENESAS [ RENESAS TECHNOLOGY CORP ]
