Surface Mount PPTC
FSMD1206 Series
THERMAL DERATING CURVE
Thermal Derat
ing Curve, FSMD1206 Series
200%
RoHS
ü
Percent of Rated Hold and Trip
Current
150%
100%
50%
0%
-40
-20
0
20
40
60
80
Ambient Tempera ture (C)
TYPICAL TIME-TO-TRIP AT 23°C
A
100
Time-to-trip (S)
10
1
Z
0.1
0.01
0.001
0.1
B
C D
Z
A
B
C
D
1
Fault current (A)
10
100
=
=
=
=
=
FSMD005-1206
FSMD010-1206
FSMD020-1206
FSMD035-1206
FSMD050-1206
PAD LAYOUTS, SOLDER REFLOW AND REWORK RECOMMENDATIONS
The dimension in the table below provide the recommended pad layout for each FSMD1206 device
NOMINAL PAD DIMENSIONS (MILLIMETERS)
SOLDER REFLOW
20 to 40 Seconds
260 °C
1.9
217 °C
f
Ramp-up
3°C/Second Max
Ramp-down
6°C/Second Max
200 °C
150 °C
Preheat
1.0
2.0
1.0
25 °C
60 to 180 Seconds
60 to 150 Seconds
Solder Reflow
Due to “Lead Free” nature, up to 40 seconds dwelling time for the soldering zone is strongly recommended.
1. Recommended reflow methods; IR, vapor phase oven, hot air oven.
2. The FSMD Series are suitable for use with wave-solder application methods. (Top side only)
3. Recommended maximum paste thickness is 0.25mm.
4. Devices can be cleaned by using standard industry methods and solvents.
5. Storage Environment: <30°C / 60%RH
Caution:
If reflow temperatures exceed the recommended profile, devices may not meet performance requirements.
Rework:
Use standard industry practices.
NOTE: All Specification subject to change without notice.
RFE International
• Tel:(949) 833-1988 • Fax:(949) 833-1788 • E-Mail Sales@rfeinc.com
C5ED01
REV 2007.8.14
RFE [ RFE INTERNATIONAL ]
