RT9168/A
Operating Region and Power Dissipation
The maximum power dissipation of RT9168/A depends
on the thermal resistance of the case and circuit board,
the temperature difference between the die junction and
ambient air, and the rate of airflow. The power dissipation
across the device is P = I
OUT
(V
IN
- V
OUT
). The maximum
power dissipation is: P
MAX
= (T
J
- T
A
) /θ
JA
where T
J
- T
A
is the temperature difference between the
RT9168/A die junction and the surrounding environment,
θ
JA
is the thermal resistance from the junction to the
surrounding environment. The GND pin of the RT9168/A
performs the dual function of providing an electrical
connection to ground and channeling heat away. Connect
the GND pin to ground using a large pad or ground plane.
DS9168/A-15 March 2007
www.richtek.com
9
RICHTEK [ RICHTEK TECHNOLOGY CORPORATION ]
