BDxxKA5 Series BDxxKA5W Series
●I/O
equivalence circuit
Vcc
Vcc Vcc
BD00KA5W Series
Datasheet
Vcc
※
31.25kΩ 2kΩ
OUT
With BD00KA5WFP/WF,R1and R2 are connected
outside the IC between ADJ and GND and
between OUT and ADJ.
CTL
25kΩ
R2
ADJ
(BD00KA5WFP/WF)
R1
Fig.18
Fig.19
●Power
Dissipation
TO252-5
2.0
Rohm standard board mounting
Board size：70×70×1.6½½
2
Copper foil area：7×7½½
θja=96.2(℃/W)
TO252-3
2.0
Rohm standard board mounting
Board size：70×70×1.6½½
2
Copper foil area：7×7½½
θja=104.2(℃/W)
Power Dissipation
：
Pd(W)
：
Power Dissipation Pd(W)
1.30
1.2
許容損失：Pd(W)
1.6
Power Dissipation
：
Pd(W)
1.6
1.20
1.2
0.8
0.8
0.4
0.4
0.0
0
25
50
75
100
125
150
0.0
0
25
50
75
100
125
150
Ambient temperature：Ta(℃)
Ambient temperature：Ta(℃)
周囲温度：Ta(℃)
Fig.20 Power Dissipation heat
reducing characteristics
SOP8
1000
(1)When using a standard board:
θj-c=181.8(℃/W)
(2) When using an IC alone
θj-a=222.2(℃/W)
Fig.21 Power Dissipation heat
reducing characteristics
Power Dissipation
：
Pd(W)
800
許容損失：Pd(W)
687.6mW
600
(1)
400
562.6mW
(2)
200
0
0
25
50
75
100
125
Ambient temperature：Ta(℃)
150
周囲温度：Ta(℃)
Fig.22 Power Dissipation heat
reducing characteristics
When using at temperatures over Ta=25℃, please refer to the power dissipation shown in Fig.20 through 22.
The IC characteristics are closely related to the temperature at which the IC is used, so if the temperature exceeds the
maximum junction temperature Tj
MAX,
the device may malfunction or be destroyed. The heat of the IC requires sufficient
consideration regarding instantaneous destruction and long-term operation reliability. In order to protect the IC from thermal
damage, it is necessary to operate it at temperatures less than the maximum junction temperature Tj
MAX.
Even when the ambient temperature Ta is a normal temperature (25℃), the chip(junction) temperature Tj may be quite high,
so please operate the IC at temperatures less than the acceptable loss Pd.
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TSZ22111½15½001
9/15
TSZ02201-0R6R0A600150-1-2
26.Jun.2012 Rev.001
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