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GBJ5002 参数 Datasheet PDF下载

GBJ5002图片预览
型号: GBJ5002
PDF下载: 下载PDF文件 查看货源
内容描述: 电压50V 〜 1000V 50.0安培玻璃Passivited桥式整流器 [Voltage 50V ~ 1000V 50.0 Amp Glass Passivited Bridge Rectifiers]
分类和应用:
文件页数/大小: 2 页 / 853 K
品牌: SECOS [ SECOS HALBLEITERTECHNOLOGIE GMBH ]
 浏览型号GBJ5002的Datasheet PDF文件第2页  
GBJ50005 ~ GBJ5010
Elektronische Bauelemente
Voltage 50V ~ 1000V
50.0 Amp Glass Passivited Bridge Rectifiers
RoHS Compliant Product
A suffix of “-C” specifies halogen & lead-free
FEATURES
Rating to 1000V PRV
Ideal for printed circuit board
Low forward voltage drop, high current capability
Reliable low cost construction utilizing molded plastic
technique results in inexpensive product
The plastic material has Underwriters Laboratory
flammability classification 94V-0
GBJ
REF.
A
B
C
D
E
F
G
H
I
Millimeter
Min.
Max.
29.7
30.3
19.7
20.3
4.4
4.8
17.0
18.0
3.0 x 45°
3.1
3.4
-
5.1
2.5
2.9
0.9
1.1
REF.
J
K
L
M
N
P
Q
R
S
Millimeter
Min.
Max.
0.6
0.8
7.3
7.7
2.0
2.4
9.8
10.2
2.3
2.7
3.6
4.2
10.8
11.2
3.1
3.4
3.4
3.8
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
(Rating 25°C ambient temperature unless otherwise specified. Single phase half wave, 60Hz, resistive or inductive load.
For capacitive load, de-rate current by 20%.)
Part Number
Parameter
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Bridge Input Voltage
Maximum DC Blocking Voltage
Maximum Average Forward (with heat sink )
Rectified Current @T
C
=100°C (without heat sink)
Peak Forward Surge Current 8.3 ms Single Half
Sine-Wave Super Imposed on Rated Load
(JEDEC Method)
Maximum Forward Voltage @ 25A DC
Maximum DC Reverse Current
at Rated DC Blocking Voltage
I t Rating for Fusing (t<8.3ms)
Typical Thermal Resistance
1
2
2
Symbol
V
RRM
V
RMS
V
DC
I
(AV)
GBJ
50005
GBJ
5001
GBJ
5002
GBJ
5004
GBJ
5006
GBJ
5008
GBJ
5010
Unit
V
V
V
A
50
35
50
100
70
100
200
140
200
400
280
400
50
600
420
600
800
560
800
1000
700
1000
I
FSM
V
F
I
R
It
R
θJC
T
J
,T
STG
2
400
1.1
10.0
A
V
µA
T
J
=25°C
T
J
=125°C
500
660
1.5
-55~150
As
°C/W
°C
2
Operating and Storage temperature range
Notes:
1. Thermal resistance from junction to case with units mounted on heat sink.
2. Device mounted on 300mm*300mm*1.6mm Cu plate heat sink.
http://www.SeCoSGmbH.com/
Any changes of specification will not be informed individually.
19-Oct-2011 Rev. A
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