GBU8A ~ GBU8M
Elektronische Bauelemente
50 V ~ 1000 V
8.0 Amp High Current Glass Passivated
Molding Single-Phase Bridge Rectifier
RoHS Compliant Product
A suffix of “-C” specifies halogen-free and RoHS Compliant
GBU
FEATURES
Plastic Package has Underwriters
Laboratory Flammability Classification 94V-0
This series is UL listed under the Recognized
Component index, file number E231047
Single-in-line package
High current capacity with small package
Superior thermal conductivity
High temperature soldering guaranted：
260°C / 10 seconds
High IFSM
E
P
B
N
D
O
Q
A
F
G
L
M
K
C
H
J
REF.
A
B
C
D
E
F
G
H
Millimeter
Min.
Max.
21.80
22.20
18.30
19.10
3.37
3.53
17.27
18.29
3.2 x 45°
3.70
3.90
5.70
5.90
2.30
2.70
REF.
J
K
L
M
N
O
P
Q
Millimeter
Min.
Max.
0.46
0.56
4.80
5.30
2.16
2.54
1.65
2.03
1.45
1.85
0.90
1.20
9.80
10.20
10.90
11.10
MAXIMUM RATINGS (T
A
=25℃ unless otherwise noted)
PART NUMBERS
PARAMETERS
Maximum repetitive voltage
Maximum DC reverse current at @T
A
=25°C
rated DC blocking voltage
@T
A
=125°C
Average rectified forward current 60Hz Sine
wave Resistance load with heatsink
@T
C
=100°C
(1)(2)
Peak Forward Surge Current, 10.0ms single
half sine-wave superimposed on rated load
Dielectric strength terminals to case,
AC 1 minute Current 1mA
Typical thermal resistance per leg
(3)
Maximum instantaneous forward voltage at 4A
Operating and Storage Temperature Range
SYMBOL
V
RM
I
R
I
O
GBU
8A
50
GBU
8B
100
GBU
8D
200
GBU
8G
400
5
500
8
GBU
8J
600
GBU
8K
800
GBU
8M
1000
UNITS
V
A
A
I
FSM
Vdia
R
θJA
R
θJC
V
F
T
J
, T
STG
200
2.5
21
2.2
A
KV
°C / W
1
150 , -55 ~ 150
V
°C
Notes：
(1)
Unit case mounted on AI plate heat-sink
(2)
Unites mounted on P.C.B without heat-sink
(3)
Recommended mounting position is to bolt down on heatsink with silicone thermal compound for maximum heat transfer
with heat-sink size：8.2 * 8.2 * 03cm
http://www.SeCoSGmbH.com/
Any changes of specification will not be informed individually.
04-Aug-2010 Rev. A
Page 1 of 2
SECOS [ SECOS HALBLEITERTECHNOLOGIE GMBH ]
