General Description of Light Emitting Diodes
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Handling Precautions
This product is sensitive to static electricity and demands a lot of
attention. Please take all possible measures for static electricity and
surge solution.
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Lead Forming Method
Avoid forming a lead pin with the lead pin base as a fulcrum: be
sure to hold a lead pin firmly when forming.
Lead pins should be formed before soldering.
(3) Installation using a holder
During an LED lamp positioning, in case of using a holder, holder A
should be designed to be smaller than the inside dimension of lead
pins. Holder B should be designed to be larger than the outside
dimension of lead pins.
(Notes)¡Pay attention to the thermal
expansion coefficient of the
material used for the holder.
A
Since the holder expands and
Holder
contracts due to preheat and
soldering heat, mechanical
B
stress may be applied to the lead
pins, resulting in disconnection.
(4) Installation to the case
Do not fix part A with adhesives
when fixed to the case as shown in
the figure.
A hole of the case should be
designed not to be smaller than the
outside diameter of LED lamp resin.
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Installation
(1) Installation on a PWB
When mounting an LED lamp on a PWB, do not apply physical
stress to the lead pins.
(Notes)¡The lead pin pitch should match the PWB pin-hole pitch:
do not broaden out or narrow down the lead pins.
¡When
positioning an LED lamp, basically employ an
LED with tie-bar cut or use a spacer.
(2) When an LED lamp is mounted directly on a PWB
If the bottom face of an LED lamp is mounted directly on single-
sided PWB (1.6mm t or more), the base of the lead pins may be
subjected to have physical stress due to PWB warp, cutting or
clinching of lead pins. Prior to use, be sure to check that no
disconnection inside of the resin or
damage to resin etc., is found.
When an LED lamp is mounted on a
double-sided PWB, the heat during
soldering affects the resin; therefore,
1.6A
keep the LED lamp more than 1.6mm
afloat above the soldering position.
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Hold a lead pin firmly when forming
A
Case
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Soldering Conditions
Solder the lead pins under the following conditions. (1.6mm or
more from the resin package)
Type of Soldering
1. Manual soldering
2. Wave soldering
3. Reflow soldering
Conditions
295˚C
±
5˚C, within 3 seconds
260˚C
±
5˚C, within 5 seconds
Preheating 70˚C to 80˚C, within 30 seconds
Soldering 245˚C
±
5˚C, within 5 seconds
Not acceptable
PWB
(Notes)¡Avoid dipping resin into soldering bath.
¡Avoid
applying stress to lead pins while they are heated.
For example, when the LED lamp is moved with the heat
applied to the lead pins during manual soldering or solder
repair, disconnection may occur.
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Acceptable
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Cleaning
Conditions described below shall be observed in cleaning.
(1) Solvent cleaning : Solvent temperature 45˚C or less, for 3 min.
(2) Ultrasonic cleaning : The affect on the device is different
depending on the size of the cleaning bath, ultrasonic output, board
size, and device mounting method. Test the cleaning method under
actual conditions and check the abnormalities before actual use.
(3) Recommended solvents are shown below.
Melthyl alcohol, Ethyl alcohol, Isopropyl alcohol.
When other solvents are used, package resin may be penetrated by
solvents. Please confirm under actual conditions before use.
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Notice
Internet
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In the absence of confirmation by device specification sheets,SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in
catalogs,data books,etc.Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Internet address for Electronic Components Group http://sharp-world.com/ecg/
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