General Description of Light Emitting Diodes
A: Lead Pin Type
s
Lead Forming Method
Avoid forming a lead pin with the lead pin base as a fulcrum: be sure to hold a
lead pin firmly when forming.
Lead pins should be formed before soldering.
(4) Installation to the case
A
Do not fix part A with adhesives when
fixed to the case as shown in the figure.
A hole of the case should be designed not
Case
to be smaller than the outside diameter of
LED lamp resin.
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s
Installation
(1) Installation on a PWB
When mounting an LED lamp on a PWB, do not apply physical stress to the lead
pins.
(Notes)¡The lead pin pitch should match the PWB pin-hole pitch: absolutely avoid
widening or narrowing the lead pins.
¡When
positioning an LED lamp, basically employ an LED with tie-bar cut or
use a spacer.
(2) When an LED lamp is mounted directly on a PWB
If the bottom face of an LED lamp is mounted directly on single-sided PWB, the
base of the lead pins may be subjected to have
physical stress due to PWB warp, cutting or
clinching of lead pins. Prior to use, be sure to
check that no disconnection inside of the resin
or damage to resin etc., is found.
1.6A
When an LED lamp is mounted on a double-
sided PWB, the heat during soldering affects
the resin; therefore, keep the LED lamp more
than 1.6mm afloat above the PWB.
(3) Installation using a holder
During an LED lamp positioning, in case of
using a holder, holder A should be designed to
be smaller than the inside diameter of lead
pins. Holder B should be designed to be larger
than the outside diameter of lead pins.
(Notes)¡Pay attention to the thermal expansion
coefficient of the material used for the
B
holder. Since the holder expands and
contracts due to preheat and soldering
heat, mechanical stress may be applied to the lead pins, resulting in
disconnection.
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Hold a lead pin firmly when forming
s
Soldering Conditions
Solder the lead pins under the following conditions.
Type of Soldering
1. Manual soldering
2. Wave soldering
3. Reflow soldering
Conditions
295˚C
±
5˚C, within 3 seconds
260˚C
±
5˚C, within 5 seconds
Preheating 70˚C to 80˚C, within 30 seconds
Soldering 245˚C
±
5˚C, within 5 seconds
(Notes)¡Avoid dipping resin into soldering bath.
¡Avoid
applying stress to lead pins while they are heated. For example, when the
LED lamp is moved with the heat applied to the lead pins during manual
soldering or solder repair, disconnection may occur.
Not acceptable
Acceptable
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Soldering
iron
Not acceptable
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PWB
s
Cleaning
(1) Solvents
The package resin may be penetrated by solvents used in cleaning. Refer to the
table below for usable solvents.
Acceptable
Solvent
Ethyl alcohol
Isopropyl alcohol
Chlorosen
Acetone
Trichloroethylene
Usable
4
Notice
Internet
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Holder
A
™
™
×
×
×
™
: Acceptable
×
: Not acceptable
(Notes)¡There is a world-wide movement to restrict the use of chrolofluorocarbon (CFC)
based solvents and we recommend that you avoid their use. However, before
using a CFC substitute solvent, carefully check that it will not penetrate the
package resin.
(2) Cleaning Methods
Cleaning Method
Solvent cleaning
Ultrasonic cleaning
Usable
™
v
Remarks
Immersion up to one minute at room temperature
Test the cleaning under actual conditions and
check for abnormalities before actual use.
™
: Acceptable
: Acceptability depends on device type and conditions
(Notes)¡The affect on the device from ultrasonic cleaning differs depending on the size
of the cleaning bath, ultrasonic output, duration, board size and device mounting
method. Test the cleaning method under actual conditions and check for
abnormalities before actual use.
¡Cleaning
with water is not allowed with the lead pins resin-tubulated: water may
remain, thus causing rust to the lead pins.
¡Please
contact our representative before using a cleaning solvent or method not
given above.
v
In the absence of confirmation by device specification sheets,SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in
catalogs,data books,etc.Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Internet address for Electronic Components Group http://www.sharp.co.jp/ecg/
SHARP [ SHARP ELECTRIONIC COMPONENTS ]
