Si510/511
2. Solder Reflow and Rework Requirements for 2.5x3.2 mm Packages
Reflow of Skyworks Solutions' components should be done in a manner consistent with the IPC/JEDEC J-STD-
20E standard. The temperature of the package is not to exceed the classification Temperature provided in the
standard. The part should not be within -5°C of the classification or peak reflow temperature (T
30 seconds.
) for longer than
PEAK
Key to maintaining the integrity of the component is providing uniform heating and cooling of the part during reflow
and rework. Uniform heating is achieved through having a preheat soak and controlling the temperature ramps in
the process.
J-STD-20E provides minimum and maximum temperatures and times for the preheat/Soak step that need to be
followed, even for rework. The entire assembly area should be heated during rework. Hot air should be flowed from
both the bottom of the board and the top of the component. Heating from the top only will cause un-even heating of
component and can lead to part integrity issues.
Temperature Ramp-up rate are not to exceed 3°C/second. Temperature ramp-down rates from peak to final
temperature are not to exceed 6°C/second. Time from 25°C to peak temperature is not to exceed 8 min for Pb-free
solders.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
11
Rev. 1.4 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • October 29, 2021
SILICON [ SILICON ]
