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STK12C68-L 参数 Datasheet PDF下载

STK12C68-L图片预览
型号: STK12C68-L
PDF下载: 下载PDF文件 查看货源
内容描述: 材质含量陶瓷LCC封装声明 [Statement of Material Content Ceramic LCC Packages]
分类和应用:
文件页数/大小: 2 页 / 31 K
品牌: SIMTEK [ SIMTEK CORPORATION ]
 浏览型号STK12C68-L的Datasheet PDF文件第2页  
Statement of Material Content  
Ceramic LCC Packages  
STK11C68-L  
STK12C68-L  
STK14C88-L  
This package type is not available in a lead-free version.  
Unit  
Detail  
28 350 LEADLESS CHIP CARRIER  
32 450 LEADLESS CHIP CARRIER  
PACKAGE MATERIALS  
Simtek Package ID  
Pin/Lead Count  
L [hot solder dip lead finish]  
28  
L [hot solder dip lead finish]  
32  
Simtek package pn  
Package Manufacturer  
Mfg Pkg ID/Simtek part ID/Dwg ID  
Simtek package Outline  
JEDEC Case Outline  
Mil Case Outline ID  
Assembly Facility  
Plant  
STK-91-01-2303  
Kyocera  
STK-91-01-3202  
NTK Technical Ceramics  
IRK32F1-5379C / STK-91-01-3202  
STK-40-05-011  
PB-CA1771 / STK-91-01-2803  
STK-40-05-007  
MO-041  
MO-041  
Figure C11, CQCC3-N28  
Amkor Technologies  
ATP1  
Figure C11, CQCC3-N32  
Amkor Technologies  
ATP1  
Leadframe Plating  
Plating Process  
Gold Plate 60µ" min over 80-250µ" Nickel Gold Plate 80µ" min Over 50-350µ" Nickel  
Electrolytic  
Electrolytic  
Kyocera 440 Black [Al2O3 90%]  
Alloy 42 [Fe 58% / Ni 42%]  
Gold Plate 80µ"  
Ceramic  
NTK ALN  
Leads  
Alloy 42 [Fe 58% / Ni 42%]  
Gold Plate 80µ"  
Sn/Pb 60/40%  
Lead Plating [Gold Underplate]  
Leads [Hot Solder Dip Finish]  
Sn/Pb 60/40%  
PACKAGE DIMENSIONS & CHARACTERISTICS  
in3  
mil  
Nominal Cavity Volume  
Die Size  
.0035  
.0062  
146x153x19  
144x374x19  
mil  
Pad Size  
214x205  
310x440  
C/W  
C/W  
C/W  
Theta Ja [still air] -approx  
Theta Ja [200fpm/1mps] - approx  
Theta Jc  
98  
73  
55  
42  
3
3
Lead Resistance  
800 mOhm Max  
3pF max [1MHz]  
500 mOhm Max  
3pF max [1MHz]  
pF  
Lead to Lead Capacitance  
SHIPPING INFORMATION  
Carrier Type  
rail  
34  
rail  
34  
qty  
gm  
Units Per Rail  
Total Product Weight  
0.9  
1.3  
LID DETAIL  
Manufacturer  
Lid Type  
Williams Advanced Materials  
Hi Rel Lid with Preform  
STK-92-10-0003  
Williams Advanced Materials  
Hi Rel Lid with Preform  
STK-92-10-0007  
Simtek Lid ID  
Dimensions  
Lid Material  
Plating  
in  
.330x.530 .280x.480 .01"  
Kovar [Fe 54% / Co 17% / Ni 29%]  
Gold 25µ" min on Nickel 50-350µ"  
Electrolytic  
.430x.530 .360x.500 .01 "  
Kovar [Fe 54% / Co 17% / Ni 29%]  
Gold 25µ" min on Nickel 50-350µ"  
Electrolytic  
µ"  
Plating Process  
Frame  
Au 80% / Sn 20%  
Au 80% / Sn 20%  
in  
Frame Thickness  
.002"  
.002"  
PL0122  
Simtek Corporation  
August 07