DATA SHEET • SMV1211–SMV1215
Recommended Solder Reflow Profiles
Profile Feature
Average ramp-up rate (T
L
to T
P
)
Preheat
Temperature min. (T
SMIN
)
Temperature max. (T
SMAX
)
Time (min. to max.) (ts)
T
SMAX
to T
L
Ramp-up rate
Time maintained above:
Temperature (T
L
)
Time (t
L
)
Peak temperature (T
P
)
Time within 5 °C of actual peak temperature (tp)
Ramp-down rate
Time 25 °C to peak temperature
SnPb Eutectic Assembly
3 °C/second max.
100 °C
150 °C
60–120 seconds
—
183 °C
60–150 seconds
240 +0/-5 °C
10–30 seconds
6 °C/second max.
6 minutes max.
Lead (Pb)-Free Assembly 100% Sn
3 °C/second max.
150 °C
200 °C
60–80 seconds
3 °C/second max.
217 °C
60–150 seconds
250 +0/-5 °C
20–40 seconds
6 °C/second max.
8 minutes max.
All temperatures refer to the topside of the package, measured on the package body surface.
Reference JEDEC J-STD-020B.
T
P
t
p
Critical Zone
T
L
to T
L
T
L
I
L
T
SMAX
Temperature
T
SMIN
t
s
Preheat
25 ˚C
t 25 ˚C to Peak
Time
Reference JEDEC J-STD-020
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
200057 Rev. B • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • December 7, 2004
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