MQFP-d
Heat Spreader Metric Quad Flat Pack
• 14 x 14mm to 32 x 32mm
• 64 to 240 lead count
• Lead pitch range from 0.80mm
to 0.50mm
FEATURES
• Body Sizes: 14 x 14mm to 32 x 32mm
• Package Height: 2.0mm to 3.4mm (same as QFP)
• Lead Counts: 64L to 240L
• Lead Pitch: 0.80mm to 0.50mm
• Moisture Sensitivity: JEDEC Level 3
• Wide range of open tool leadframe and die pad sizes
available
• JEDEC standard compliant
• Lead-free and Green material sets available
DESCRIPTION
STATS ChipPAC’s Heat Spreader Metric Quad Flat Pack
(MQFP-d) is a thermally enhanced version of the QFP
package. Thermal enhancement is achieved by an embedded
anodized aluminum heat spreader which is dropped in
during the mold process. This process allows the use of
standard leadframe while offering an added margin of
thermal performance for high power applications. The
QFP-d package offers 30% improvement (typical) in thermal
performance over standard MQFP packages.
APPLICATIONS
• ASIC
• DSP
• FPGA
• PLD
• High speed logic, high power microprocessors /
controllers
• 3D graphics, telecom, wireless, audio, CPU / GUI
www.statschippac.com
STATSCHIP [ STATS CHIPPAC, LTD. ]
