TSSOP
and
MSOP
Small Outline Packages
SPECIFICATIONS (TSSOP)
Die Thickness
Gold Wire
Lead Finish
Marking
Packing Options
9-11mil range preferred (TSSOP)
6-16mil range preferred (TSSOP-ep)
20µm (0.8mils) diameter, 99.99% Au
Sn/Pb (85/15%) or Matte Tin
Laser
Tube
RELIABILITY (all)
Temperature Cycling
Temp/Humidity Test
Pressure Cooker Test
Condition C, -65°C/150°C, 1000 cycles
85°C/85% RH, 1000 hrs
121°C, 100% RH, 2 atm, 250 hrs
SPECIFICATIONS (MSOP)
Die Thickness
Gold Wire
Lead Finish
Marking
Packing Options
6-9mil range preferred
20µm (0.8mils) diameter, 99.99% Au
Sn/Pb (85/15%) or Matte Tin
Laser
Tube
THERMAL PERFORMANCE,
θ
ja (°C/W)
Package
30L TSSOP
30L TSSOP-ep
Body Size (mm)
4.4 x 7.8 x 0.9
4.4 x 7.8 x 0.9
Pad Size
3.0 x 3.0
3.0 x 3.0
Die Size
2.54 x 2.54
2.54 x 2.54
PCB Vias
0
9
Thermal Performance
θ
ja (°C/W)
74.0
49.5
Note: Simulation data for package mounted on 4 layer PCB (per JEDEC JESD51-5) under natural convection as defined in JESD51.2.
ELECTRICAL PERFORMANCE:
4.4 x 9.7 x 0.9 (38L)
Conductor
Component
Lead
Wire
TOTALS
Note: Results are simulated values at 100MHz.
Pad Size
(mm)
185 x 113
Lead/Wire
(mm)
0.6-3.09
1.65
Resistance
(mOhm)
5-25
99
104-124
Inductance
Self (nH)
Mutual (nH)
0.30-1.70
1.36
1.66-3.06
0.14-0.77
0.37-0.65
0.51-1.42
Capacitance
Self (pF)
Mutual (pF)
0.09-0.46
0.08
0.17-0.54
0.04-0.21
0.01-0.02
0.05-0.23
CROSS-SECTION
TSSOP
TSSOP-ep
PACKAGE CONFIGURATIONS
Package
TSSOP
Body Size (mm)
3.0 x 4.4
5.0 x 4.4
6.5 x 4.4
7.8 x 4.4
9.7 x 4.4
7.8 x 4.4
Lead Count
8
14, 16
20
24
38
30
48
56
8, 10
MSOP
MSOP
12.5 x 6.1
14.0 x 6.1
3.0 x 3.0
Corporate Office
Global Offices
10 Ang Mo Kio St. 65, #05-17/20 Techpoint, Singapore 569059 Tel: 65-6824-7777 Fax: 65-6720-7823
USA 510-979-8000
JAPAN 81-43-351-3320
KOREA 82-31-639-8911 TAIWAN 886-3-593-6565
CHINA 86-21-5976-5858
UK 44-1483-413-700
MALAYSIA 603-4257-6222
NETHERLANDS 31-38-333-2023
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©Copyright 2005. STATS ChipPAC Ltd. All rights reserved.
January 2005