Ordering information
EMIF02-MIC02F3
Figure 14. Footprint
Copper pad Diameter:
220 µm recommended
260 µm maximum
Solder mask opening:
300 µm minimum
Figure 15. Marking
Dot, ST logo
xx = marking
z = manufacturing location
yww = datecode
(y = year
ww = week)
E
Solder stencil opening :
220 µm recommended
x x z
y ww
Figure 16. Flip Chip tape and reel specifications
Dot identifying Pin A1 location
4 ± 0.1
Ø 1.5 ± 0.1
1.75 ± 0.1
3.5 ± 0.1
0.87
0.71 ± 0.05
All dimensions in mm
8 ± 0.3
ST
E
ST
E
ST
E
xxz
yww
User direction of unreeling
xxz
yww
xxz
yww
4 ± 0.1
1.27
Note:
More information is available in the application notes:
AN2348: “STMicroelectronics 400 micro-metre Flip Chip: Package description and
recommendation for use”
AN1751: EMI Filters: Recommendations and measurements
5
Ordering information
Table 3.
Ordering information
Marking
HB
Package
Flip Chip
Base qty
5000
Delivery mode
Tape and reel (7”)
Order code
EMIF02-MIC02F3
6/8
STMICROELECTRONICS [ STMICROELECTRONICS ]
