Characteristics
EMIF06-SD03F3
2
Table 3.
Symbol
Characteristics
Absolute maximum ratings
Parameter
A SIDE (Host-CPU)
All pins: HBM IEC61340-3-1
V
ccA
, Enable, Dat123.dir, CMD.dir, CMD.h, CLK.h,
CLK -f, Dat0.dir, Dat0.h, Dat1.h, Dat2.h, Dat3.h, V
bat
ESD
B SIDE (SD-Card)
External pins : IEC 61000-4-2, level 4
V
ccB
, CMD-B, CLK-B, Dat0-B, Dat1-B, Dat2-B,
Dat3-B, WP, CD
T
jmax
Maximum junction temperature
Thermal resistance from junction to ambient
Board: Epoxy FR4, copper thickness = 40 µm, 4 layers
Maximum power dissipation:
P
dmax
= (T
jmax
- T
aopmax
)/ Rth (j-a)
Storage temperature range
V
bat
, V
ccB
, Enable
CMD-B, CLK-B, Dat0-B, Dat1-B, Dat2-B, Dat3-B
Value
Unit
Air discharge
Contact discharge
2
2
kV
Air discharge
Contact discharge
15
8
150
64
1
-55 to +150
-0.3 to 5.5V
-0.3 to V
ccB
+ 0.3
-0.3 to 3.3
-0.3 to V
ccA
+0.3
V
°C
°C/
W
W
°C
R
th (j-a) (1)
P
dmax
T
stg
Voltage
V
ccA
Dat123.dir, CMD.dir, CMD.h, CLK.h, CLK -f, Dat0.dir, Dat0.h, Dat1.h, Dat2.h,
Dat3.h, WP, CD
1. VccB is an internally generated power supply, no external voltage should be applied on this pin other than a current clamp.
The thermal resistance depends on printed circuit board layout. To dissipate the heat efficiently away from Flip Chip bumps,
it is better to make copper planes the largest possible as well as considering thermal vias usage.
6/23
Doc ID 15194 Rev 2
STMICROELECTRONICS [ STMICROELECTRONICS ]
