欢迎访问ic37.com |
会员登录 免费注册
发布采购

STM32F103ZC 参数 Datasheet PDF下载

STM32F103ZC图片预览
型号: STM32F103ZC
PDF下载: 下载PDF文件 查看货源
内容描述: 基于ARM的高性能线的32位MCU,具有高达512 KB的闪存, USB , CAN ,11个定时器,3个ADC和13通信接口 [Performance line, ARM-based 32-bit MCU with up to 512 KB Flash, USB, CAN, 11 timers, 3 ADCs and 13 communication interfaces]
分类和应用: 闪存通信
文件页数/大小: 118 页 / 1231 K
品牌: STMICROELECTRONICS [ STMICROELECTRONICS ]
 浏览型号STM32F103ZC的Datasheet PDF文件第102页浏览型号STM32F103ZC的Datasheet PDF文件第103页浏览型号STM32F103ZC的Datasheet PDF文件第104页浏览型号STM32F103ZC的Datasheet PDF文件第105页浏览型号STM32F103ZC的Datasheet PDF文件第107页浏览型号STM32F103ZC的Datasheet PDF文件第108页浏览型号STM32F103ZC的Datasheet PDF文件第109页浏览型号STM32F103ZC的Datasheet PDF文件第110页  
Package characteristics
STM32F103xC, STM32F103xD, STM32F103xE
6
6.1
Package characteristics
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK
®
packages. These packages have a Lead-free second-level interconnect. The category of
second-level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97.
The maximum ratings related to soldering conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
106/118