VN820-E / VN820SO-E / VN820SP-E / VN820B5-E / VN820PT-E
Figure 3. Configuration Diagram (Top View) & Suggested Connections for Unused and N.C. Pins
1
V
CC
OUTPUT
OUTPUT
OUTPUT
OUTPUT
OUTPUT
OUTPUT
8
9
V
CC
V
CC
N.C.
GROUND
INPUT
STATUS
N.C.
N.C.
6
7
8
9
10
11
5
4
3
2
1
16
OUTPUT
OUTPUT
OUTPUT
OUTPUT
OUTPUT
GND
INPUT
STATUS
N.C.
N.C.
V
CC
V
CC
PowerSO-10
PPAK / P
2
PAK / PENTAWATT
SO-16L
Connection / Pin Status
Floating
X
To Ground
N.C.
X
X
Output
X
Input
X
Through 10KΩ resistor
Figure 4. Current and Voltage Conventions
I
S
V
F
I
IN
INPUT
I
STAT
STATUS
GND
V
IN
V
STAT
I
GND
V
OUT
OUTPUT
I
OUT
V
CC
V
CC
Table 4. Thermal Data
Symbol
R
thj-case
R
thj-lead
R
thj-amb
R
thj-amb
(1)
Value
PowerSO-10 PENTAWATT P
2
PAK SO-16L PPAK
Thermal Resistance Junction-case
Max
1.9
1.9
1.9
-
1.9
Thermal Resistance Junction-lead
Max
-
-
-
15
-
(1)
(1)
(1)
65
(2)
76.9
(1)
Thermal Resistance Junction-ambient Max
51.9
61.9
51.9
(3)
Thermal Resistance Junction-ambient Max
37
-
37
(3)
48
(4)
45
(3)
Parameter
Unit
°C/W
°C/W
°C/W
°C/W
When mounted on a standard single-sided FR-4 board with 0.5cm
2
of Cu (at least 35µm thick).
(2)
When mounted on FR4 printed circuit board with 0.5cm
2
of Cu (at least 35µ thick) connected to all V
CC
pins.
(3)
When mounted on a standard single-sided FR-4 board with 6cm
2
of Cu (at least 35µm thick).
(4)
When mounted on FR4 printed circuit board with 6cm
2
of Cu (at least 35µ thick) connected to all V
CC
pins.
3/38
STMICROELECTRONICS [ STMICROELECTRONICS ]
