Quali kationsprüfungen
Quali cation tests
Die Quali kation der HR SMT Chipinduktivitäten erfolgt
nach AEC-Q200, Table 5 (induktive Bauelemente), MIL-
STD-202, MIL STD 981 und ASTM E 595.
AEC-Q200 Tab. 5
No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
The quali cation of HR SMT Chip Inductances is done
according to AEC-Q200, Table 5 (inductive components),
MIL-STD-202, MIL 981 and ASTM E 595.
AEC-Q200 Tab. 5
Test
Physical Dimensions
Electrical Characterization
Solderability / Resistance to
dissolution of metallization
Terminal Strength
Board Flex
Resistance to Soldering Heat
High Temperature Exposure
Temperature Cycling /
Thermal Shock
Biased Humidity
Mechanical Shock
Vibration
ESD
Resistance to Solvents
Operational Life
Moisture Resistance
Sn Whisker
Conditon
(referenced at Tab. 5)
Notes
JESD22 Method JB-100
and SUMIDA Components Spec.
AEC Q 200
and SUMIDA Components Spec
J-STD-002
AEC-Q200-006
AEC-Q200-005
J-STD-020
MIL-STD-202 Method 108
MIL-STD-202 Method 107
JESD22 Method JA-104
MIL-STD-202 Method 103
MIL-STD-202 Method 213
MIL-STD-202 Method 204
AEC-Q200-002
MIL-STD-202 Method 215
MIL-PRF-27
MIL-STD-202 Method 106
JESD22 Mehtod A104 JESD 201
T = 125 °C
(t = 1000 hrs. with rated current)
T = 125 °C (t = 1000 hrs.)
T = -55 / 125 °C (1000 cycles)
85 °C / 85% RH (t = 1000 hrs.)
Condition C
5g
1.8 kg for 60 sec.
(1,0 kg for 0603)
2 mm for 60 sec.
Temp.: -55°C / 25 °C / 125 °C
Zusatzprüfungen
No.
17
18
19
20
21
Additional tests
Test
Mechanical Shock
Vibration
Moisture Sensitivity (MSL)
Outgassing
Resistance to Solvents
Conditon
Notes
MIL-STD-202 Method 213
MIL-STD-202 Method 204
J-STD-020
ASTM E 595
MIL-STD-202 Method 215
Condition F
Condition H
MSL 1
Bioact EC-7R Cleaner
-3-
SUMIDA [ SUMIDA CORPORATION ]
