WIRE-WOUND CHIP INDUCTORS (LB SERIES)，
WIRE-WOUND CHIP POWER INDUCTORS (CB SERIES)，
WIRE-WOUND CHIP INDUCTORS FOR SIGNAL LINES (LB SERIES M TYPE)
■PRECAUTIONS
1．Circuit Design
◆Operating environment
1. The products described in this specification are intended for use in general electronic equipment, (office supply equipment,
telecommunications systems, measuring equipment, and household equipment). They are not intended for use in mission-critical
Precautions
equipment or systems requiring special quality and high reliability (traffic systems, safety equipment, aerospace systems, nuclear
control systems and medical equipment including life-support systems,) where product failure might result in loss of life, injury or
damage. For such uses, contact TAIYO YUDEN Sales Department in advance.
2．PCB Design
◆Land pattern design
Precautions
1. Please contact any of our offices for a land pattern, and refer to a recommended land pattern of a right figure or specifications.
PRECAUTIONS
【Recommended Land Patterns】
Technical
Surface Mounting
considerations
・ Mounting and soldering conditions should be checked beforehand.
・ Applicable soldering process to those products is reflow soldering only.
3．Considerations for automatic placement
◆Adjustment of mounting machine
Precautions
1. Excessive impact load should not be imposed on the products when mounting onto the PC boards.
2. Mounting and soldering conditions should be checked beforehand.
Technical
1. When installing products, care should be taken not to apply distortion stress as it may deform the products.
considerations
4．Soldering
Precautions
◆Reflow soldering（ LB and CB Types）
1. For reflow soldering with either leaded or lead-free solder, the profile specified in "point for controlling" is recommended.
◆Recommended conditions for using a soldering iron
1. Put the soldering iron on the land-pattern. Soldering iron's temperature - Below 350℃ Duration-3 seconds or less. The soldering iron
should not come in contact with inductor directly.
◆Reflow soldering（ LB and CB Types）
1. Reflow profile
Technical
considerations
◆Recommended conditions for using a soldering iron
1. Components can be damaged by excessive heat where soldering conditions exceed the specified range.
5．Cleaning
Precautions
◆Cleaning conditions
Washing by supersonic waves shall be avoided.
Technical
◆Cleaning conditions
considerations
If washed by supersonic waves, the products might be broken.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_CB_LB_prec_e-E02R01
TAIYO YUDEN [ TAIYO YUDEN (U.S.A.), INC ]
