(1/3)
Chip Beads(SMD Array)
For General Signal Line
MZA Series MZA3216 Type
FEATURES
• A single MZA series chip provides noise attenuation for four
lines, making it ideal for use with I/O lines of various highly
miniaturized.
• Electronic equipment, such as portable products, which
comprise high density circuitry.
• Low crosstalk between adjacent circuits.
• Internal electrodes feature low DC resistance, minimizing
wasteful power consumption.
• Electroplated terminal electrodes accommodate reflow
soldering.
• Monolithic structure ensures high reliability.
• The products contain no lead and also support lead-free
soldering.
• It is a product conforming to RoHS directive.
APPLICATIONS
High-frequency noise countermeasure in computers, printers,
VCRs, televisions, portable telephones, and other equipment.
PRODUCT IDENTIFICATION
MZA 3216 R 121 A T
(1)
(2) (3) (4) (5) (6)
(1) Series name
(2) Dimensions L× W
(3) Material code
(4) Nominal impedance
121:120Ω at 100MHz
(5) Characteristic type
(6) Packaging style
T:Taping
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
Conformity to RoHS Directive
SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD
PATTERN (REFLOW SOLDERING)
3.2±0.2
Ferrite
0.15min.
1.6±0.2
Terminal
electrode
0.6
0.8
0.4
2.6
0.8±0.1
0.8±0.2
0.4±0.15
Weight: 20mg
Dimensions in mm
TEMPERATURE RANGES
Operating/storage
–55 to +125°C
PACKAGING STYLE AND QUANTITIES
Packaging style
Taping
Quantity
4000 pieces/reel
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components. The preheat-
ing temperature should be set so that the temperature difference
between the solder temperature and product temperature does
not exceed 150°C.
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed cir-
cuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
• This product does not apply to flow soldering construction
method.
10s max.
250 to 260˚C
230˚C
Natural
cooling
180˚C
150˚C
Preheating
60 to 120s
Time(s)
Soldering
30 to 60s
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• Please contact our Sales office when your application are considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• All specifications are subject to change without notice.
007-01 / 20071025 / e9421_mza.fm
TDK [ TDK ELECTRONICS ]
