REVISIONS
LTR
C
DESCRIPTION
Update boilerplate of document. Add devices 06 and 07. Add vendor
CAGE 61772 as source of supply for devices 06 and 07. Editorial
changes throughout.
Changes in accordance with NOR 5962-R187-95
Updated boilerplate to one-part, one-part number format. Added
provisions for the inclusion of radiation-hardened devices. - glg
Drawing updated to reflect current requirements. - glg
Updated boilerplate paragraphs. Added 08 device. ksr
Added packages T and N. Dose rate and total dose numbers were
changed; vendor had not previously shipped radhard devices. ksr
DATE (YR-MO-DA)
93-11-15
APPROVED
M. A. Frye
D
E
F
G
H
95-08-14
00-01-21
01-01-17
01-07-27
02-02-04
M. A. Frye
Raymond Monnin
Raymond Monnin
Raymond Monnin
Raymond Monnin
THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED.
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
STANDARD MICROCIRCUIT
DRAWING
THIS DRAWING IS
AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
H
15
H
16
H
17
H
18
REV
SHEET
PREPARED BY
Kenneth Rice
CHECKED BY
Ray Monnin
APPROVED BY
Michael. A. Frye
H
19
H
20
H
21
H
1
H
22
H
2
H
23
H
3
H
24
H
4
H
25
H
5
H
26
H
6
H
27
H
7
H
28
H
8
H
29
H
9
H
30
H
10
H
31
H
11
H
32
H
12
H
13
H
14
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216
http://www.dscc.dla.mil
DRAWING APPROVAL DATE
08 Nov 1989
REVISION LEVEL
H
MICROCIRCUITS, MEMORY,
DIGITAL, CMOS, 4K X 9 FIFO,
MONOLITHIC SILICON
SIZE
A
SHEET
1 OF
31
5962-E221-02
CAGE CODE
67268
5962-89568
DSCC FORM 2233
APR 97
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
TEMIC [ TEMIC SEMICONDUCTORS ]
