PACKAGE OPTION ADDENDUM
www.ti.com
30-Mar-2005
PACKAGING INFORMATION
Orderable Device
CD54HC540F3A
CD54HC541F
CD54HC541F3A
CD54HCT541F
CD54HCT541F3A
CD74HC540E
CD74HC540M
CD74HC540M96
CD74HC541E
CD74HC541M
CD74HC541M96
CD74HC541PW
CD74HC541PWR
CD74HC541SM
CD74HCT540E
CD74HCT540M
CD74HCT540M96
CD74HCT541E
CD74HCT541M
CD74HCT541M96
(1)
Status
(1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
OBSOLETE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package
Type
CDIP
CDIP
CDIP
CDIP
CDIP
PDIP
SOIC
SOIC
PDIP
SOIC
SOIC
TSSOP
TSSOP
SSOP
PDIP
SOIC
SOIC
PDIP
SOIC
SOIC
Package
Drawing
J
J
J
J
J
N
DW
DW
N
DW
DW
PW
PW
DB
N
DW
DW
N
DW
DW
Pins Package Eco Plan
(2)
Qty
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
25
2000
20
25
2000
1
1
1
1
1
20
25
2000
20
25
2000
70
2000
TBD
TBD
TBD
TBD
TBD
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Lead/Ball Finish
Call TI
Call TI
Call TI
Call TI
Call TI
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
MSL Peak Temp
(3)
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
Level-NC-NC-NC
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
Level-1-250C-UNLIM
Level-1-250C-UNLIM
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
Level-NC-NC-NC
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
Level-NC-NC-NC
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
for the latest availability information and additional product content details.
TBD:
The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
Addendum-Page 1
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