DAC5574
SLAS407 – DECEMBER 2003
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated
circuits be handled with appropriate precautions. Failure to observe proper handling and installation
procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision
integrated circuits may be more susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
PACKAGE/ORDERING INFORMATION
(1)
PRODUCT
PACKAGE
PACKAGE
DRAWING
NUMBER
DGS
SPECIFICATION
TEMPERATURE
RANGE
–40°C TO +105°C
PACKAGE
MARKING
D574
ORDERING
NUMBER
DAC5574IDGS
DAC5574IDGSR
(1)
TRANSPORT MEDIA
DAC5574
10-MSOP
80 Piece Tube
2500 Piece Tape and Reel
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at
DGS PACKAGE
(TOPVIEW)
PIN
NAME
V
OUT
A
V
OUT
B
GND
V
OUT
C
V
OUT
D
SCL
SDA
V
DD
A0
A1
PIN DESCRIPTIONS
DESCRIPTION
Analog output voltage from DAC A
Analog output voltage from DAC B
Ground reference point for all circuitry on the
part
Analog output voltage from DAC C
Analog output voltage from DAC D
Serial clock input
Serial data input and output
Analog voltage supply input
Device address select - I
2
C
Device address select - I
2
C
V
OUT
A
V
OUT
B
GND
1
2
3
DAC5574
10 A1
9 A0
8 V
DD
7 SDA
6 SCL
1
2
3
4
5
6
7
8
9
10
V
OUT
C 4
V
OUT
D 5
.
ABSOLUTE MAXIMUM RATINGS
(1)
V
DD
to GND
Digital input voltage to GND
V
OUT
to GND
Operating temperature range
Storage temperature range
Junction temperature range (T
J
max)
Power dissipation:
Lead temperature, soldering:
Thermal impedance (ΘJA)
Thermal impedance (ΘJC)
Vapor phase (60s)
Infrared (15s)
(1)
–0.3 V to +6 V
–0.3 V to V
DD
+ 0.3 V
–0.3 V to V
DD
+ 0.3 V
–40°C to +105°C
–65°C to +150°C
+150°C
270°C/W
77°C/W
215°C
220°C
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute
maximum conditions for extended periods may affect device reliability.
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