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GC5318IZED 参数 Datasheet PDF下载

GC5318IZED图片预览
型号: GC5318IZED
PDF下载: 下载PDF文件 查看货源
内容描述: 高密度数字上变频器 [HIGH-DENSITY DIGITAL UPCONVERTER]
分类和应用: 电信集成电路蜂窝电话电路电信电路PC
文件页数/大小: 45 页 / 554 K
品牌: TI [ TEXAS INSTRUMENTS ]
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GC5318
HIGH-DENSITY DIGITAL UPCONVERTER
SLWS187 – JULY 2006
1 Introduction
1.1 Features
Optimized for CDMA2000-1X and UMTS
Up to 12 UMTS or 24 CDMA2000 Upconverter
Channels
Mixed CDMA2000-1X and UMTS Operation
DUC Output Rates to 125 MSPS
Any DUC Can Sum into Any of Four Output
Ports
Real/Complex DUC Outputs
Tx Filtering: 6-Stage CIC, 47-Tap CFIR, 63-Tap
PFIR
115-dB SFDR
18-Bit DUC Outputs
1.5-V Core, 3.3-V I/O
1.1.1 Description
The GC5318 is a high-density multi-channel communications signal processor integrated circuit that
provides digital upconversion optimized for cellular base transceiver systems. The device supports both
UMTS and CDMA2000 (CDMA) air interface cellular standards.
The chip provides up to 24 CDMA digital upconverter (DUC) channels or 12 UMTS DUC channels. The
GC5318 can also support a combination of CDMA and UMTS channels. The DUC channels operate
simultaneously.
The chip is ideal for cellular base transceiver systems where a large number of digital radio channels are
required. Each of the 24 CDMA (or 12 UMTS) channels can operate independently.
There are four 18-bit output ports. Each output port can sum any of the DUC channels in a daisy-chain
fashion. This configuration permits creating a stack of CDMA or UMTS signals. These ports can output
either real or complex data. Real output data would generally drive one or more digital-to-analog (D/A)
converters and output the stack of signals at an intermediate frequency (IF). Complex data (at baseband
or an IF) is used when a quadrature modulator upconversion scheme is employed. Complex output data
can also be used when the output stack is further processed using crest factor reduction or power
amplifier predistortion techniques.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this document.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2006, Texas Instruments Incorporated