LM158/LM258/LM358/LM2904
Absolute Maximum Ratings
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
LM158/LM258/LM358
LM158A/LM258A/LM358A
Supply Voltage, V
+
Differential Input Voltage
Input Voltage
Power Dissipation (Note 1)
Molded DIP
Metal Can
Small Outline Package (M)
micro SMD
Output Short-Circuit to GND
(One Amplifier) (Note 2)
V
+
≤
15V and T
A
= 25˚C
Input Current (V
IN
<
−0.3V) (Note 3)
Operating Temperature Range
LM358
LM258
LM158
Storage Temperature Range
Lead Temperature, DIP
(Soldering, 10 seconds)
Lead Temperature, Metal Can
(Soldering, 10 seconds)
Soldering Information
Dual-In-Line Package
Soldering (10 seconds)
Small Outline Package
Vapor Phase (60 seconds)
Infrared (15 seconds)
215˚C
220˚C
260˚C
300˚C
260˚C
0˚C to +70˚C
−25˚C to +85˚C
−55˚C to +125˚C
−65˚C to +150˚C
Continuous
50 mA
830 mW
550 mW
530 mW
435mW
32V
32V
−0.3V to +32V
LM2904
26V
26V
−0.3V to +26V
830 mW
530 mW
Continuous
50 mA
−40˚C to +85˚C
−65˚C to +150˚C
260˚C
300˚C
260˚C
215˚C
220˚C
See AN-450 “Surface Mounting Methods and Their Effect on Product Reliability” for other methods of soldering
surface mount devices.
ESD Tolerance (Note 10)
250V
250V
Electrical Characteristics
V
+
= +5.0V, unless otherwise stated
Parameter
Input Offset Voltage
Input Bias Current
Input Offset Current
Input Common-Mode
Voltage Range
Supply Current
Conditions
A
= 25˚C
I
IN(+)
or I
IN(−)
, T
A
= 25˚C,
V
CM
= 0V, (Note 6)
I
IN(+)
− I
IN(−)
, V
CM
= 0V, T
A
= 25˚C
V = 30V, (Note 7)
(LM2904, V = 26V), T
A
= 25˚C
Over Full Temperature Range
R
L
=
∞
on All Op Amps
V
+
= 30V (LM2904 V
+
= 26V)
V = 5V
+
+
+
LM158A
Min Typ
1
20
2
0
Max
2
50
10
V −1.5
+
LM358A
Min Typ
2
45
5
0
Max
3
100
30
V −1.5
+
LM158/LM258
Min Typ
2
45
3
0
Max
5
150
30
V −1.5
+
Units
mV
nA
nA
V
1
0.5
2
1.2
1
0.5
2
1.2
1
0.5
2
1.2
mA
mA
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