SNOS748E – SEPTEMBER 1999 – REVISED MARCH 2013
(1)
Absolute Maximum Ratings
ESD Tolerance
Voltage at Input
Voltage at Output Pin
Supply Voltage (V –V )
Current at Input Pin
(3)
(4) (5)
+
−
(2)
2 kV
V +0.3V, V
−0.3V
V
+
+0.3V, V
−
−0.3V
15V
16V
±5 mA
±30 mA
40 mA
260°C
150°C
+
−
Differential Input Voltage
Current at Output Pin
Current at Power Supply Pin
Lead Temperature (soldering, 10 sec.)
Junction Temperature
(1)
(2)
(3)
(4)
(5)
(6)
(6)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of
JEDEC)Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
All limits are specified by testing or statistical analysis.
Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150°C. Output currents in excess of ±30 mA may adversely affect reliability.
Limiting input pin current is only necessary for input voltages which exceed the absolute maximum input voltage rating.
The maximum power dissipation is a function of T
J(MAX)
,
θ
JA
. The maximum allowable power dissipation at any ambient temperature is
P
D
= (T
J(MAX)
– T
A
)/
θ
JA
. All numbers apply for packages soldered directly onto a PC Board.
(1)
Operating Ratings
Supply Voltage
Temperature Range
(2)
2.7
≤
V
CC
≤
15V
−40°C
to +85°C
180°C/W
325°C/W
LMC7221AI, LMC7221BI
Thermal Resistance (θ
JA
)
8-Pin SOIC
5-Pin SOT-23
(1)
(2)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
The maximum power dissipation is a function of T
J(MAX)
,
θ
JA
. The maximum allowable power dissipation at any ambient temperature is
P
D
= (T
J(MAX)
– T
A
)/
θ
JA
. All numbers apply for packages soldered directly onto a PC Board.
2.7V Electrical Characteristics
Unless otherwise specified, all limits ensured for T
J
= 25°C, V
+
= 2.7V, V
−
= 0V, V
CM
= V
O
= V
+
/2.
Boldface
limits apply at the
temperature extremes.
Parameter
V
OS
TCV
OS
Input Offset Voltage
Input Offset Voltage
Temperature Drift
Input Offset Voltage Average
Drift
I
B
I
OS
CMRR
PSRR
(1)
(2)
(3)
2
Input Current
Input Offset Current
Common Mode Rejection Ratio
Power Supply Rejection Ratio
0V
≤
V
CM
≤
2.7V
2.7V
≤
V
≤
15V
+
(3)
Test Conditions
Typ
(1)
3
1.0
3.3
0.04
0.02
75
80
LMC7221AI
Limit
(2)
5
8
LMC7221BI
Limit
(2)
15
18
Units
mV
max
μV/°C
μV/Month
pA
pA
dB
dB
Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary
over time and will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped
production material.
All limits are specified by testing or statistical analysis.
C
L
includes the probe and test jig capacitance.
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