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LMP91300NHZR 参数 Datasheet PDF下载

LMP91300NHZR图片预览
型号: LMP91300NHZR
PDF下载: 下载PDF文件 查看货源
内容描述: LMP91300工业电感式接近传感器AFE [LMP91300 Industrial Inductive Proximity Sensor AFE]
分类和应用: 传感器接近传感器
文件页数/大小: 37 页 / 1036 K
品牌: TI [ TEXAS INSTRUMENTS ]
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SNOSCS3A – SEPTEMBER 2013 – REVISED OCTOBER 2013
(1)
ABSOLUTE MAXIMUM RATINGS
Over operating free-air temperature range (unless otherwise noted)
Voltage at pins 1-5, 7, 10, 11, 17, 18 (B1, B2, B4, C1, C2, C3, C4, D2, D4, E2)
Voltage at pins 6, 15, 19, 22 (B3, D3)
Voltage at pin 8 (E4)
Voltage at pin 9 (E3)
Voltage at pins 12, 13 (D1, E1)
Current at pins 20, 21 (A1, A2)
Voltage at pins 23, 24 (A3, A4)
Operating Temperature, T
A
Storage Temperature, T
STG
Junction Temperature, T
J
ESD Rating
(3)
(2)
(V+) + 0.3V
0.3V
6V
7V
48V
8mA
1.6V
−40°C
to +125°C
−65°C
to +150°C
+150°C
2000V
500V
Human Body Model (HBM)
Charge-Device Model (CDM)
(1)
(2)
(3)
Stresses beyond those listed under
Absolute Maximum Ratings
may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under
Recommended Operating
Conditions
is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The maximum power dissipation is a function of T
J(MAX)
,
θ
JA
, and T
A
. The maximum allowable power dissipation at any ambient
temperature is P
D
= (T
J(MAX)
- T
A
)/
θ
JA
. All numbers apply for packages soldered directly onto a PC board.
Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Field-Induced Charge-Device Model, applicable std. JESD22-C101-
C (ESD FICDM std. of JEDEC).
THERMAL CHARACTERISTICS
(1) (2)
Over operating free-air temperature range (unless otherwise noted)
PARAMETER
θ
JA
θ
JA
(1)
(2)
Package Thermal Impedance
Package Thermal Impedance
TEST CONDITIONS
24-Pin WQFN
20-Pin DSBGA
MIN
TYP
33.2
46
MAX
UNIT
°C/W
°C/W
The maximum power dissipation is a function of T
J(MAX)
,
θ
JA
, and T
A
. The maximum allowable power dissipation at any ambient
temperature is P
D
= (T
J(MAX)
- T
A
)/
θ
JA
. All numbers apply for packages soldered directly onto a PC board.
The package thermal impedance is calculated in accordance with JESD 51-7.
RECOMMENDED OPERATING CONDITIONS
(1)
Over operating free-air temperature range (unless otherwise noted)
MIN
V
LOOP
(1)
Loop Voltage
6.5
NOM
MAX
40
UNIT
V
Stresses beyond those listed under
Absolute Maximum Ratings
may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under
Recommended Operating
Conditions
is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Copyright © 2013, Texas Instruments Incorporated
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