PIN CONFIGURATIONS
Top View
DIP/SOIC
ABSOLUTE MAXIMUM RATINGS
(1)
Supply Voltage ..................................................................................
±18V
Input Voltage Range .............................................. +V
S
+ 2V to –V
S
– 2V
Differential Input Range ....................................................... Total V
S
+ 4V
Power Dissipation ........................................................................ 1000mW
Operating Temperature
M Package .................................................................. –55°C to +125°C
P, U Package ............................................................. –40°C to +125°C
Storage Temperature
M Package .................................................................. –65°C to +150°C
P, U Package ............................................................. –40°C to +125°C
Junction Temperature
M Package .................................................................................. +175°C
P, U Package ............................................................................. +150°C
Lead Temperature (soldering, 10s) ............................................... +300°C
SOlC (soldering, 3s) ................................................................... +260°C
NOTE: (1) Stresses above these ratings may cause permanent damage.
Offset Trim
–In
+In
–V
S
1
2
3
4
8
7
6
5
No Internal Connection
+V
S
Output
Offset Trim
Top View
No Internal Connection
8
Offset Trim
1
7
+V
S
TO-99
PACKAGE/ORDERING INFORMATION
PRODUCT
OPA627AP
OPA627BP
OPA627AU
OPA627AM
OPA627BM
OPA627SM
OPA637AP
OPA637BP
OPA637AU
OPA637AM
OPA637BM
OPA637SM
PACKAGE
Plastic DIP
Plastic DIP
SOIC
TO-99 Metal
TO-99 Metal
TO-99 Metal
Plastic DIP
Plastic DIP
SOIC
TO-99 Metal
TO-99 Metal
TO-99 Metal
PACKAGE DRAWING
NUMBER
(1)
006
006
182
001
001
001
006
006
182
001
001
001
TEMPERATURE
RANGE
–25°C to +85°C
–25°C to +85°C
–25°C to +85°C
–25°C to +85°C
–25°C to +85°C
–55°C to +125°C
–25°C to +85°C
–25°C to +85°C
–25°C to +85°C
–25°C to +85°C
–25°C to +85°C
–55°C to +125°C
–In
2
6
Output
3
+In
4
–V
S
Case connected to –V
S
.
5
Offset Trim
NOTE: (1) For detailed drawing and dimension table, please see end of data
sheet, or Appendix C of Burr-Brown IC Data Book.
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degrada-
tion to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet its
published specifications.
®
3
OPA627, 637
TI [ TEXAS INSTRUMENTS ]
