PIN CONFIGURATION
PIN ASSIGNMENTS
TOP VIEW
SOIC
PIN
1
NAME
DATA
BCLK
NC
I/O
IN
IN
—
—
—
FUNCTION
Serial Audio Data Input.
Bit Clock Input for Serial Audio Data.
No Connection.
2
3
1
2
20
19
18
17
16
15
14
13
12
11
DATA
BCLK
NC
–VCC
4
–VDD
DGND
Digital Power, –5V.
Digital Ground.
REF DC
NC
5
3
6
+VDD
WCLK
NC
—
IN
Digital Power, +5V.
Data Latch Enable Input.
No Connection.
4
–VDD
SERVO DC
AGND
AGND
IOUT
7
8
—
5
DGND
+VDD
PCM1704U
9
20BIT
INVERT
+VCC
IN
Input Data Word Selection(1)
Input Data Polarity Selection(1)
.
.
6
10
11
12
13
14
15
16
IN
7
WCLK
NC
—
Analog Power, +5V.
8
NC
BPO DC
NC
—
Bipolar Offset Decoupling Capacitor.
No Connection.
9
20BIT
INVERT
BPO DC
+VCC
—
IOUT
OUT
—
Current Output for Audio Signal.
Analog Ground.
10
AGND
AGND
—
Analog Ground.
17 SERVO DC
—
Servo Amplifier Decoupling Capacitor.
No Connection.
18
19
20
NC
REF DC
–VCC
—
PACKAGE INFORMATION
—
Band Gap Reference Decoupling Capacitor.
Analog Power, –5V.
PACKAGE
—
TEMPERATURE
RANGE
DRAWING
NUMBER(1)
PRODUCT
PACKAGE
NOTE: (1) Internal pull-up resistors. Input level must be a voltage from –VDD
to DGND.
PCM1704U
20-Lead SOIC
–25°C to +85°C
248
NOTE: (1) For detailed drawing and dimension table, please see end of data
sheet, or Appendix C of Burr-Brown IC Data Book.
ELECTROSTATIC
DISCHARGE SENSITIVITY
ABSOLUTE MAXIMUM RATINGS
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
Supply Voltage, +VDD ,+VCC ............................................................. +6.5V
Supply Voltage Differences .............................................................. ±0.1V
GND Voltage Differences ................................................................. ±0.1V
Digital Input Voltage
(BCLK, WCLK, DATA) ............................ DGND –0.3V to (+VDD + 0.3V)
(20BIT, INVERT) .................................... –VDD – 0.3V to (DGND + 0.3V)
Input Current (any pins except supply pins) ................................... ±10mA
Power Dissipation .......................................................................... 300mW
Operating Temperature Range ......................................... –25°C to +85°C
Storage Temperature ...................................................... –55°C to +125°C
Lead Temperature (soldering, 5s) ................................................. +260°C
Package Temperature (reflow, 10s) .............................................. +235°C
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
®
3
PCM1704
TI [ TEXAS INSTRUMENTS ]
