PACKAGE OPTION ADDENDUM
www.ti.com
28-Feb-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
LCCC
CDIP
CFP
Drawing
5962-9678201Q2A
5962-9678201QRA
5962-9678201QSA
5962-9678201SA
5962-9678201VRA
5962-9678201VSA
SN74AHC244DBLE
SN74AHC244DBR
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
OBSOLETE
ACTIVE
FK
J
20
20
20
20
20
20
20
20
1
1
1
None
None
None
None
None
None
None
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Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
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W
W
J
CFP
CDIP
CFP
1
1
Level-NC-NC-NC
Level-NC-NC-NC
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W
DB
DB
SSOP
SSOP
2000
2000
25
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
SN74AHC244DGVR
SN74AHC244DW
SN74AHC244DWR
SN74AHC244N
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
TVSOP
SOIC
SOIC
PDIP
DGV
DW
DW
N
20
20
20
20
20
20
Pb-Free
(RoHS)
CU NIPDAU Level-1-250C-UNLIM
Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
2000
20
Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
SN74AHC244NSR
SN74AHC244PW
SO
NS
2000
70
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
TSSOP
PW
Pb-Free
(RoHS)
CU NIPDAU Level-1-250C-UNLIM
SN74AHC244PWLE
SN74AHC244PWR
OBSOLETE TSSOP
PW
PW
20
20
None
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ACTIVE
TSSOP
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SNJ54AHC244FK
SNJ54AHC244J
SNJ54AHC244W
ACTIVE
ACTIVE
ACTIVE
LCCC
CDIP
CFP
FK
J
20
20
20
1
1
1
None
None
None
Call TI
Call TI
Call TI
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
W
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
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