SCES373L− SEPTEMBER 2001 − REVISED NOVEMBER 2003
SN74AUC1G07
SINGLE BUFFER/DRIVER
WITH OPEN DRAIN OUTPUT
D
Available in the Texas Instruments
D
D
D
D
D
D
D
D
NanoStar and NanoFree Packages
Optimized for 1.8-V Operation and Is 3.6-V
I/O Tolerant to Support Mixed-Mode Signal
Operation
I
off
Supports Partial-Power-Down Mode
Operation
Sub 1-V Operable
Max t
pd
of 2.5 ns at 1.8 V
Low Power Consumption, 10-µA Max I
CC
±8-mA
Output Drive at 1.8 V
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
DBV OR DCK PACKAGE
(TOP VIEW)
NC
A
GND
1
2
3
5
4
V
CC
Y
NC − No internal connection
YEA, YEP, YZA, OR YZP PACKAGE
(BOTTOM VIEW)
GND
A
DNU
3 4
2
1 5
Y
V
CC
DNU − Do not use
description/ordering information
This single buffer/driver is operational at 0.8-V to 2.7-V V
CC
, but is designed specifically for 1.65-V to 1.95-V
V
CC
operation.
The output of the SN74AUC1G07 is open drain and can be connected to other open-drain outputs to implement
active-low wired-OR or active-high wired-AND functions.
NanoStar and NanoFree package technology is a major breakthrough in IC packaging concepts, using the
die as the package.
ORDERING INFORMATION
TA
PACKAGE†
NanoStar − WCSP (DSBGA)
0.17-mm Small Bump − YEA
NanoFree − WCSP (DSBGA)
0.17-mm Small Bump − YZA (Pb-free)
−40°C to 85°C
NanoStar − WCSP (DSBGA)
0.23-mm Large Bump − YEP
NanoFree − WCSP (DSBGA)
0.23-mm Large Bump − YZP (Pb-free)
SOT (SOT-23) − DBV
SOT (SC-70) − DCK
Tape and reel
Tape and reel
Tape and reel
SN74AUC1G07YEPR
SN74AUC1G07YZPR
SN74AUC1G07DBVR
SN74AUC1G07DCKR
U07_
UV_
ORDERABLE
PART NUMBER
SN74AUC1G07YEAR
SN74AUC1G07YZAR
_ _ _UV_
TOP-SIDE
MARKING‡
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
‡ DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code,
and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition
(1 = SnPb,
•
= Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar and NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright
2003, Texas Instruments Incorporated
POST OFFICE BOX 655303
•
DALLAS, TEXAS 75265
1
TI [ TEXAS INSTRUMENTS ]
