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SN74BCT2241DWE4 参数 Datasheet PDF下载

SN74BCT2241DWE4图片预览
型号: SN74BCT2241DWE4
PDF下载: 下载PDF文件 查看货源
内容描述: 八路缓冲器和线路/带三态输出的MOS驱动器 [OCTAL BUFFER AND LINE/MOS DRIVER WITH 3-STATE OUTPUTS]
分类和应用: 总线驱动器总线收发器逻辑集成电路光电二极管输出元件信息通信管理
文件页数/大小: 12 页 / 369 K
品牌: TI [ TEXAS INSTRUMENTS ]
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SN74BCT2241
OCTAL BUFFER AND LINE/MOS DRIVER
WITH 3-STATE OUTPUTS
SCBS035D – SEPTEMBER 1988 – REVISED MARCH 2003
D
D
D
D
D
Operating Voltage Range of 4.5 V to 5.5 V
State-of-the-Art BiCMOS Design
Significantly Reduces I
CCZ
Output Ports Have Equivalent 33-Ω Series
Resistors, So No External Resistors Are
Required
3-State Outputs Drive Bus Lines or Buffer
Memory Address Registers
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
DW, N OR NS PACKAGE
(TOP VIEW)
description/ordering information
1OE
1A1
2Y4
1A2
2Y3
1A3
2Y2
1A4
2Y1
GND
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
V
CC
2OE
1Y1
2A4
1Y2
2A3
1Y3
2A2
1Y4
2A1
This SN74BCT2241 is designed specifically to
improve both the performance and density of
3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. Together with the
’BCT2240 and ’BCT2244 devices, this device provides the choice of selected combinations of inverting and
noninverting outputs, symmetrical active-low output-enable (OE) inputs, and complementary OE and OE
inputs. This device features high fan-out and improved fan-in.
To ensure the high-impedance state during power up or power down, OE should be tied to V
CC
through a pullup
resistor and OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is
determined by the current-sinking/current-sourcing capability of the driver.
The outputs, which are designed to source or sink up to 12 mA, include 33-Ω series resistors to reduce overshoot
and undershoot.
ORDERING INFORMATION
TA
PDIP – N
0°C to 70°C
SOIC – DW
SOP – NS
PACKAGE†
Tube
Tube
Tape and reel
Tape and reel
ORDERABLE
PART NUMBER
SN74BCT2241N
SN74BCT2241DW
SN74BCT2241DWR
SN74BCT2241NSR
TOP-SIDE
MARKING
SN74BCT2241N
BCT2241
BCT2241
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
FUNCTION TABLES
INPUTS
1OE
L
L
H
1A
H
L
X
OUTPUT
1Y
H
L
Z
INPUTS
2OE
H
H
L
2A
H
L
X
OUTPUT
2Y
H
L
Z
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright
2003, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
1