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SN74HC367PWG4 参数 Datasheet PDF下载

SN74HC367PWG4图片预览
型号: SN74HC367PWG4
PDF下载: 下载PDF文件 查看货源
内容描述: HEX缓冲器和线路驱动器,具有三态输出 [HEX BUFFERS AND LINE DRIVERS WITH 3-STATE OUTPUTS]
分类和应用: 总线驱动器总线收发器逻辑集成电路光电二极管输出元件
文件页数/大小: 17 页 / 658 K
品牌: TI [ TEXAS INSTRUMENTS ]
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SCLS309D − JANUARY 1996 − REVISED SEPTEMBER 2003
SN54HC367, SN74HC367
HEX BUFFERS AND LINE DRIVERS
WITH 3 STATE OUTPUTS
D
Wide Operating Voltage Range of 2 V to 6 V
D
High-Current 3-State Outputs Drive Bus
D
D
D
D
D
Lines, Buffer Memory Address Registers,
or Drive Up To 15 LSTTL Loads
True Outputs
Low Power Consumption, 80-µA Max I
CC
Typical t
pd
= 10 ns
±6-mA
Output Drive at 5 V
Low Input Current of 1
µA
Max
SN54HC367 . . . J OR W PACKAGE
SN74HC367 . . . D, N, NS, OR PW PACKAGE
(TOP VIEW)
description/ordering information
These hex buffers and line drivers are designed
specifically to improve both the performance and
density of 3-state memory address drivers, clock
drivers, and bus-oriented receivers and
transmitters. The ’HC367 devices are organized
as dual 4-line and 2-line buffers/drivers with
active-low output-enable (1OE and 2OE) inputs.
When OE is low, the device passes noninverted
data from the A inputs to the Y outputs. When OE
is high, the outputs are in the high-impedance
state.
1OE
1A1
1Y1
1A2
1Y2
1A3
1Y3
GND
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
V
CC
2OE
2A2
2Y2
2A1
2Y1
1A4
1Y4
SN54HC367 . . . FK PACKAGE
(TOP VIEW)
1A1
1OE
NC
V
CC
2OE
1Y1
1A2
NC
1Y2
1A3
4
5
6
7
8
3 2 1 20 19
18
17
16
15
14
9 10 11 12 13
2A2
2Y2
NC
2A1
2Y1
NC − No internal connection
ORDERING INFORMATION
TA
PDIP − N
PACKAGE†
Tube of 25
Tube of 40
SOIC − D
−40°C to 85°C
SOP − NS
Reel of 2500
Reel of 250
Reel of 2000
Tube of 90
TSSOP − PW
CDIP − J
−55°C to 125 C
−55 C 125°C
CFP − W
LCCC − FK
Reel of 2000
Reel of 250
Tube of 25
Tube of 150
Tube of 55
ORDERABLE
PART NUMBER
SN74HC367N
SN74HC367D
SN74HC367DR
SN74HC367DT
SN74HC367NSR
SN74HC367PW
SN74HC367PWR
SN74HC367PWT
SNJ54HC367J
SNJ54HC367W
SNJ54HC367FK
SNJ54HC367J
SNJ54HC367W
SNJ54HC367FK
HC367
HC367
HC367
TOP-SIDE
MARKING
SN74HC367N
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
On products compliant to MIL PRF 38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
Copyright
2003, Texas Instruments Incorporated
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
1Y3
GND
NC
1Y4
1A4
1