SN74LVC1G58
CONFIGURABLE MULTIPLE-FUNCTION GATE
www.ti.com
SCES415I – NOVEMBER 2002 – REVISED JUNE 2005
FEATURES
•
•
•
•
•
•
Available in the Texas Instruments
NanoStar™ and NanoFree™ Packages
Supports 5-V V
CC
Operation
Inputs Accept Voltages to 5.5 V
Max t
pd
of 6.3 ns at 3.3 V
Low Power Consumption, 10-µA Max I
CC
±24-mA Output Drive at 3.3 V
DBV PACKAGE
(TOP VIEW)
DCK PACKAGE
(TOP VIEW)
•
•
•
I
off
Supports Partial-Power-Down Mode
Operation
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
DRL PACKAGE
(TOP VIEW)
YEA, YEP, YZA,
OR YZP PACKAGE
(BOTTOM VIEW)
In1
GND
In0
1
6
In2
V
CC
Y
In1
GND
1
2
3
6
5
4
In2
V
CC
Y
In1
GND
In0
1
2
3
6
5
4
In2
V
CC
Y
In0
GND
In1
3 4
2 5
1 6
Y
V
CC
In2
2
5
4
In0
3
See mechanical drawings for dimensions.
DESCRIPTION/ORDERING INFORMATION
This configurable multiple-function gate is designed for 1.65-V to 5.5-V V
CC
operation.
The SN74LVC1G58 features configurable multiple functions. The output state is determined by eight patterns of
3-bit input. The user can choose the logic functions AND, OR, NAND, NOR, XOR, inverter, and noninverter. All
inputs can be connected to V
CC
or GND.
This device functions as an independent gate, but because of Schmitt action, it may have different input
threshold levels for positive-going (V
T+
) and negative-going (V
T–
) signals.
ORDERING INFORMATION
T
A
PACKAGE
(1)
NanoStar™ – WCSP (DSBGA)
0.17-mm Small Bump – YEA
NanoFree™ – WCSP (DSBGA)
0.17-mm Small Bump – YZA (Pb-free)
–40°C to 85°C
NanoStar™ – WCSP (DSBGA)
0.23-mm Large Bump – YEP
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free)
SOT (SOT-23) – DBV
SOT (SC-70) – DCK
SOT (SOT-553) – DRL
(1)
(2)
Tape and reel
Tape and reel
Reel of 4000
ORDERABLE PART NUMBER
SN74LVC1G58YEAR
SN74LVC1G58YZAR
Tape and reel
SN74LVC1G58YEPR
SN74LVC1G58YZPR
SN74LVC1G58DBVR
SN74LVC1G58DCKR
SN74LVC1G58DRLR
C58_
CP_
CP_
_ _ _CP_
TOP-SIDE MARKING
(2)
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
DBV/DCK/DRL: The actual top-side marking has one additional character that designates the assembly/test site.
YEA/YZA,YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one
following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb,
•
= Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar, NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2002–2005, Texas Instruments Incorporated
TI [ TEXAS INSTRUMENTS ]
