SN74LVC2G17
DUAL SCHMITT TRIGGER BUFFER
SCES381E − JANUARY 2002 − REVISED SEPTEMBER 2003
D
Available in the Texas Instruments
D
D
D
D
D
D
D
D
D
D
NanoStar and NanoFree Packages
Supports 5-V V
CC
Operation
Inputs Accept Voltages to 5.5 V
Max t
pd
of 5.4 ns at 3.3 V
Low Power Consumption, 10-µA Max I
CC
±24-mA
Output Drive at 3.3 V
Typical V
OLP
(Output Ground Bounce)
<0.8 V at V
CC
= 3.3 V, T
A
= 25°C
Typical V
OHV
(Output V
OH
Undershoot)
>2 V at V
CC
= 3.3 V, T
A
= 25°C
I
off
Supports Partial-Power-Down Mode
Operation
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 1000-V Charged-Device Model (C101)
DBV OR DCK PACKAGE
(TOP VIEW)
1A
GND
2A
1
2
3
6
5
4
1Y
V
CC
2Y
YEA, YEP, YZA, OR YZP PACKAGE
(BOTTOM VIEW)
2A
GND
1A
3 4
2 5
1 6
2Y
V
CC
1Y
description/ordering information
This dual Schmitt-trigger buffer is designed for 1.65-V to 5.5-V V
CC
operation.
The SN74LVC2G17 contains two buffers and performs the Boolean function Y = A. The device functions as two
independent buffers, but because of Schmitt action, it may have different input threshold levels for positive-going
(V
T+
) and negative-going (V
T−
) signals.
ORDERING INFORMATION
TA
PACKAGE†
NanoStar − WCSP (DSBGA)
0.17-mm Small Bump − YEA
NanoFree − WCSP (DSBGA)
0.17-mm Small Bump − YZA (Pb-free)
NanoStar − WCSP (DSBGA)
0.23-mm Large Bump − YEP
−40 C to 85 C
−40°C 85°C
NanoFree − WCSP (DSBGA)
0.23-mm Large Bump − YZP (Pb-free)
Reel of 3000
SOT (SOT-23) − DBV
SOT (SC-70) − DCK
Reel of 250
Reel of 3000
Reel of 250
Reel of 3000
SN74LVC2G17YEPR
SN74LVC2G17YZPR
SN74LVC2G17DBVR
SN74LVC2G17DBVT
SN74LVC2G17DCKR
SN74LVC2G17DCKT
C7_
C17_
ORDERABLE
PART NUMBER
SN74LVC2G17YEAR
SN74LVC2G17YZAR
_ _ _C7_
TOP-SIDE
MARKING‡
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
‡ DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code,
and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition
(1 = SnPb,
•
= Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar and NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright
2003, Texas Instruments Incorporated
POST OFFICE BOX 655303
•
DALLAS, TEXAS 75265
1
TI [ TEXAS INSTRUMENTS ]
