TLC372, TLC372Q, TLC372Y
LinCMOS™ DUAL DIFFERENTIAL COMPARATORS
SLCS114B – NOVEMBER 1983 – REVISED MARCH 1999
TLC372Y chip information
These chips, when properly assembled, display characteristics similar to the TLC372C. Thermal compression
or ultrasonic bonding can be used on the doped-aluminum bonding pads. Chips can be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
VCC +
(8)
+
–
+
–
57
(8)
(4)
(4)
GND
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 3.6
×
3.6 MINIMUM
TJmax = 150°C
TOLERANCES ARE
±
10%.
(1)
57
(2)
(3)
ALL DIMENSIONS ARE IN MILS.
PIN (4) INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
(5)
(6)
2IN +
2IN –
(1)
1OUT
(7)
(6)
(5)
1IN +
1IN –
2OUT
(3)
(2)
(7)
POST OFFICE BOX 655303
•
DALLAS, TEXAS 75265
3
TI [ TEXAS INSTRUMENTS ]
