PACKAGE OPTION ADDENDUM
www.ti.com
22-Feb-2005
PACKAGING INFORMATION
Orderable Device
TLC548CD
TLC548CDR
TLC548CP
TLC548ID
TLC548IDR
TLC548IP
TLC549CD
TLC549CDR
TLC549CP
TLC549ID
TLC549IDR
TLC549IP
TLC549IPS
TLC549IPSR
TLC549MP
(1)
Status
(1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
OBSOLETE
Package
Type
SOIC
SOIC
PDIP
SOIC
SOIC
PDIP
SOIC
SOIC
PDIP
SOIC
SOIC
PDIP
SO
SO
PDIP
Package
Drawing
D
D
P
D
D
P
D
D
P
D
D
P
PS
PS
P
Pins Package Eco Plan
(2)
Qty
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
75
2500
50
75
2500
50
75
2500
50
75
2500
50
80
2000
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
None
None
None
Lead/Ball Finish
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Call TI
MSL Peak Temp
(3)
Level-2-260C-1YEAR/
Level-1-220C-UNLIM
Level-2-260C-1YEAR/
Level-1-220C-UNLIM
Level-NC-NC-NC
Level-2-260C-1YEAR/
Level-1-220C-UNLIM
Level-2-260C-1YEAR/
Level-1-220C-UNLIM
Level-NC-NC-NC
Level-2-260C-1YEAR/
Level-1-220C-UNLIM
Level-2-260C-1YEAR/
Level-1-220C-UNLIM
Level-NC-NC-NC
Level-2-260C-1YEAR/
Level-1-220C-UNLIM
Level-2-260C-1YEAR/
Level-1-220C-UNLIM
Level-NC-NC-NC
Level-1-220C-UNLIM
Level-1-220C-UNLIM
Call TI
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check
for the latest availability information and additional
product content details.
None:
Not yet available Lead (Pb-Free).
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The
information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
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