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TLV2217-33PWR 参数 Datasheet PDF下载

TLV2217-33PWR图片预览
型号: TLV2217-33PWR
PDF下载: 下载PDF文件 查看货源
内容描述: 低压差固定电压稳压 [LOW DROPOUT FIXED VOLTAGE REGULATORS]
分类和应用: 调节器光电二极管输出元件
文件页数/大小: 11 页 / 319 K
品牌: TI [ TEXAS INSTRUMENTS ]
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TLV2217
LOW DROPOUT FIXED VOLTAGE REGULATORS
SLVS067K − MARCH 1992 − REVISED AUGUST 2004
description/ordering information (continued)
The TLV2217 family of low-dropout regulators offers a variety of fixed-voltage options that offer a maximum
continuous input voltage of 16 V, making them more versatile than CMOS regulators. Utilizing a pnp pass
element, these regulators are capable of sourcing 500 mA of current, with a specified maximum dropout of
500 mV (3.3-V and 2.5-V options), making these regulators ideal for low-voltage applications. Additionally, the
TLV2217 regulators offer very tight output accuracy of
±2%
across operating load and temperature ranges.
Other convenient features the regulators provide are internal overcurrent limiting, thermal-overload protection,
and overvoltage protection. The TLV2217 family of regulators is available in fixed voltages of 1.8 V, 2.5 V, and
3.3 V.
absolute maximum ratings over operating virtual junction temperature range (unless otherwise
noted)
Continuous input voltage, V
I
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 V
Operating virtual junction temperature, T
J
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Storage temperature range, T
stg
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
package thermal data (see Note 1)
PACKAGE
PowerFLEX/TO-252 (KTP)
TO-220 (KC/KCS)
TSSOP (PW)
BOARD
High K, JESD 51-5
High K, JESD 51-5
High K, JESD 51-7
θ
JP*
3°C/W
3°C/W
32°C/W
θ
JC
θ
JA
28°C/W
19°C/W
83°C/W
*For packages with exposed thermal pads, such as QFN, PowerPAD, and PowerFLEX,
θ
JP is defined as the thermal resistance between the die
junction and the bottom of the exposed pad.
NOTE 1: Maximum power dissipation is a function of TJ(max),
θ
JA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
recommended operating conditions
MIN
VI
IO
Input voltage
Output current
3.0
0
0
MAX
12
500
125
UNIT
V
mA
°C
TJ
Operating virtual junction temperature range
‡ Minimum VI is equal to 3.0 V or VO(max) + 0.6 V, whichever is greater.
2
POST OFFICE BOX 655303
DALLAS, TEXAS 75265