TLV225x, TLV225xA
Advanced LinCMOS RAIL-TO-RAIL
VERY LOW-POWER OPERATIONAL AMPLIFIERS
SLOS185C – FEBRUARY 1997 – REVISED – MARCH 2001
TLV2252 AVAILABLE OPTIONS
PACKAGED DEVICES
TA
VIOmax
AT 25°C
850
µV
µ
1500
µV
850
µV
µ
1500
µV
850
µV
1500
µV
SMALL
OUTLINE†
(D)
TLV2252AID
TLV2252ID
TLV2252AQD
TLV2252QD
—
—
CHIP
CARRIER
(FK)
—
—
—
—
TLV2252AMFK
TLV2252MFK
CERAMIC
DIP
(JG)
—
—
—
—
TLV2252AMJG
TLV2252MJG
PLASTIC
DIP
(P)
TLV2252AIP
TLV2252IP
—
—
—
—
TSSOP‡
(PW)
TLV2252AIPWLE
—
—
—
—
—
CERAMIC
FLATPACK
(U)
—
—
—
—
TLV2252AMU
TLV2252MU
– 40°C to 125°C
– 40°C to 125°C
– 55°C to 125°C
† The D packages are available taped and reeled. Add R suffix to device type (e.g., TLV2252CDR).
‡ The PW package is available only left-end taped and reeled.
§ Chips are tested at 25°C.
TLV2254 AVAILABLE OPTIONS
PACKAGED DEVICES
TA
VIOmax
AT 25°C
850
µV
µ
1500
µV
850
µV
µ
1500
µV
850
µV
1500
µV
SMALL
OUTLINE†
(D)
TLV2254AID
TLV2254ID
TLV2254AQD
TLV2254QD
—
—
CHIP
CARRIER
(FK)
—
—
—
—
TLV2254AMFK
TLV2254MFK
CERAMIC
DIP
(J)
—
—
—
—
TLV2254AMJ
TLV2254MJ
PLASTIC
DIP
(N)
TLV2254AIN
TLV2254IN
—
—
—
—
TSSOP‡
(PW)
TLV2254AIPWLE
—
—
—
—
—
CERAMIC
FLATPACK
(W)
—
—
—
—
TLV2254AMW
TLV2254MW
– 40°C to 125°C
– 40°C to 125°C
– 55°C to 125°C
† The D packages are available taped and reeled. Add R suffix to device type (e.g., TLV2254CDR).
‡ The PW package is available only left-end taped and reeled.
§ Chips are tested at 25°C.
2
POST OFFICE BOX 655303
•
DALLAS, TEXAS 75265
TI [ TEXAS INSTRUMENTS ]
