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TLV2362IPWR 参数 Datasheet PDF下载

TLV2362IPWR图片预览
型号: TLV2362IPWR
PDF下载: 下载PDF文件 查看货源
内容描述: 高性能低电压运算放大器 [HIGH-PERFORMANCE LOW-VOLTAGE OPERATIONAL AMPLIFIERS]
分类和应用: 运算放大器放大器电路光电二极管
文件页数/大小: 17 页 / 276 K
品牌: TI [ TEXAS INSTRUMENTS ]
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TLV2361, TLV2361Y, TLV2362, TLV2362Y
HIGH-PERFORMANCE LOW-VOLTAGE OPERATIONAL AMPLIFIERS
SLOS195B – FEBRUARY 1997 – REVISED OCTOBER 1998
D
D
D
D
D
D
Low Supply-Voltage
Operation . . . V
CC
=
±1
V Min
Wide Bandwidth . . . 7 MHz Typ at
V
CC
±
=
±2.5
V
High Slew Rate . . . 3 V/µs Typ at
V
CC
±
=
±2.5
V
Wide Output Voltage Swing . . .
±2.4
V Typ
at V
CC
±
=
±2.5
V, R
L
= 10 kΩ
Low Noise . . . 8 nV/√Hz Typ at f = 1 kHz
Package Options Include SOT-23 (DBV)
Package for the TLV2361 and Plastic
Small-Outline (D), Thin Shrink
Small-Outline (PW), and Dual-In-Line (P)
Packages for the TLV2362
TLV2361 . . . DBV PACKAGE
(TOP VIEW)
IN+
V
CC
IN–
1
2
3
5
V
CC
+
4
OUT
TLV2362 . . . D, P, OR PW PACKAGE
(TOP VIEW)
1OUT
1IN–
1IN+
V
CC
1
2
3
4
8
7
6
5
V
CC
+
2OUT
2IN–
2IN+
description
The TLV236x devices are high-performance dual operational amplifiers built using an original Texas
Instruments bipolar process. These devices can be operated at a very low supply voltage (±1 V), while
maintaining a wide output swing. The TLV236x devices offer a dramatically improved dynamic range of signal
conditioning in low-voltage systems. The TLV236x devices also provide higher performance than other
general-purpose operational amplifiers by combining higher unity-gain bandwidth and faster slew rate. With
their low distortion and low-noise performance, these devices are well suited for audio applications.
The C-suffix devices are characterized for operation from 0°C to 70°C and the I-suffix devices are characterized
for operation from –40°C to 85°C.
TLV2361 AVAILABLE OPTIONS
PACKAGED DEVICES
TA
0°C to 70°C
–40°C to 85°C
SOT-23
(DBV)†
TLV2361CDBV
TLV2361IDBV
SYMBOL
VAAC
VAAI
CHIP
FORM‡
(Y)
TLV2361Y
† The DBV packages are only available taped and reeled.
‡ Chip forms are specified for operation at 25°C only.
TLV2362 AVAILABLE OPTIONS
TA
–20°C to 85°C
PACKAGED DEVICES
SMALL OUTLINE§
PLASTIC DIP
(D)
(P)
TLV2362ID
TLV2362IP
TSSOP
(PW)
TLV2362IPWR
CHIP
FORM‡
(Y)
TLV2362Y
‡ Chip forms are specified for operation at 25°C only.
§ The D packages are available taped and reeled. Add an R to the package suffix (e.g., TLV2362IDR).
¶ The PW packages are available left-ended taped and reeled only, (e.g., TLV2362IPWR).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright
©
1998, Texas Instruments Incorporated
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
1