TLV2442, TLV2442A, TLV2444, TLV2444A
Advanced LinCMOS RAIL-TO-RAIL OUTPUT
WIDE-INPUT-VOLTAGE OPERATIONAL AMPLIFIERS
SLOS169H – NOVEMBER 1996 – REVISED MARCH 2001
TLV2442 AVAILABLE OPTIONS
PACKAGED DEVICES
V
max
IO
SMALL
OUTLINE
(D)
CERAMIC FLAT
T
A
CHIP CARRIER
(FK)
CERAMIC DIP
(JG)
TSSOP
(PW)
AT 25°C
PACK
(U)
0°C to 70°C
2.5 mV
TLV2442CD
—
—
TLV2442CPW
—
950 µV
2.5 mV
TLV2442AID
TLV2442ID
—
—
—
—
TLV2442AIPW
—
—
–40°C to 85°C
—
950 µV
2.5 mV
TLV2442AQD
TLV2442QD
—
—
—
—
TLV2442AQPW
TLV2442QPW
—
—
–40°C to 125°C
–55°C to 125°C
950 µV
2.5 mV
—
—
TLV2442AMFK
TLV2442MFK
TLV2442AMJG
TLV2442MJG
—
—
TLV2442AMU
TLV2442MU
The D and PW packages are available taped and reeled. Add R suffix to device type (e.g., TLV2442CDR).
TLV2444 AVAILABLE OPTIONS
PACKAGED DEVICES
V
max
IO
SMALL
OUTLINE
(D)
T
A
TSSOP
(PW)
AT 25°C
0°C to 70°C
2.5 mV
TLV2444CD
TLV2444CPW
950 µV
2.5 mV
TLV2444AID
TLV2444ID
TLV2444AIPW
TLV2444IPW
–40°C to 125°C
The D and PW packages are available taped and reeled. Add R suffix to device type (e.g., TLV2444CDR).
TLV2442
D OR JG PACKAGE
(TOP VIEW)
TLV2442
PW PACKAGE
(TOP VIEW)
1
2
3
8
7
6
5
1OUT
1IN–
1IN+
/GND
V
DD+
1OUT
1IN–
1IN+
/GND
V
DD+
1
2
3
4
8
7
6
5
2OUT
2IN–
2IN+
2OUT
2IN–
2IN+
4
V
DD –
V
DD–
TLV2442
U PACKAGE
(TOP VIEW)
TLV2444
D OR PW PACKAGE
TLV2442
FK PACKAGE
(TOP VIEW)
(TOP VIEW)
NC
1OUT
1IN –
1IN +
/GND
NC
V
2OUT
2IN –
2IN +
1
10
9
1
2
3
4
5
6
7
14
13
12
11
10
9
1OUT
1IN–
1IN+
4OUT
4IN–
4IN+
+
2
3
4
5
DD
8
3
2
1
20 19
18
NC
NC
1IN–
NC
7
4
5
6
7
8
V
+
V
/GND
DD
DD–
V
2OUT
NC
6
17
16
15
14
DD–
2IN+
2IN–
3IN+
3IN–
3OUT
2IN–
NC
1IN+
NC
8
2OUT
9 10 11 12 13
NC – No internal connection
2
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