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TPA701DGNRG4 参数 Datasheet PDF下载

TPA701DGNRG4图片预览
型号: TPA701DGNRG4
PDF下载: 下载PDF文件 查看货源
内容描述: 700 - mW的MONO低压音频功率放大器 [700-mW MONO LOW-VOLTAGE AUDIO POWER AMPLIFIER]
分类和应用: 消费电路商用集成电路音频放大器视频放大器功率放大器光电二极管低压音频
文件页数/大小: 25 页 / 727 K
品牌: TI [ TEXAS INSTRUMENTS ]
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TPA701
700-mW MONO LOW-VOLTAGE AUDIO POWER AMPLIFIER
SLOS229D – NOVEMBER1998 – REVISED MAY 2003
D
Fully Specified for 3.3-V and 5-V Operation
D
Wide Power Supply Compatibility
D
D
D
D
2.5 V – 5.5 V
Output Power for R
L
= 8
– 700 mW at V
DD
= 5 V, BTL
– 250 mW at V
DD
= 3.3 V, BTL
Ultralow Quiescent Current in Shutdown
Mode . . . 1.5 nA
Thermal and Short-Circuit Protection
Surface-Mount Packaging
– SOIC
– PowerPAD MSOP
D OR DGN PACKAGE
(TOP VIEW)
SHUTDOWN
BYPASS
IN+
IN–
1
2
3
4
8
7
6
5
V
O
GND
V
DD
V
O
+
description
The TPA701 is a bridge-tied load (BTL) audio power amplifier developed especially for low-voltage applications
where internal speakers are required. Operating with a 3.3-V supply, the TPA701 can deliver 250-mW of
continuous power into a BTL 8-Ω load at less than 0.6% THD+N throughout voice band frequencies. Although
this device is characterized out to 20 kHz, its operation was optimized for narrower band applications such as
wireless communications. The BTL configuration eliminates the need for external coupling capacitors on the
output in most applications, which is particularly important for small battery-powered equipment. This device
features a shutdown mode for power-sensitive applications with a supply current of 1.5 nA during shutdown.
The TPA701 is available in an 8-pin SOIC surface-mount package and the surface-mount PowerPAD MSOP,
which reduces board space by 50% and height by 40%.
VDD 6
RF
Audio
Input
RI
CI
4
3
IN –
IN+
VDD/2
VO+ 5
CS
+
VDD
2
CB
BYPASS
+
VO– 8
7
GND
700 mW
From System Control
1
SHUTDOWN
Bias
Control
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright
1998 – 2003, Texas Instruments Incorporated
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
1