µA741, µA741Y
GENERAL-PURPOSE OPERATIONAL AMPLIFIERS
SLOS094B – NOVEMBER 1970 – REVISED SEPTEMBER 2000
µA741Y
chip information
This chip, when properly assembled, displays characteristics similar to the
µA741C.
Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
VCC+
(7)
+
–
(4)
VCC –
(6)
OUT
(7)
(6)
IN +
IN –
(3)
(2)
(8)
OFFSET N1
OFFSET N2
(1)
(5)
45
(5)
(1)
(4)
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4
×
4 MINIMUM
TJmax = 150°C.
(2)
36
(3)
TOLERANCES ARE
±
10%.
ALL DIMENSIONS ARE IN MILS.
POST OFFICE BOX 655303
•
DALLAS, TEXAS 75265
3
TI [ TEXAS INSTRUMENTS ]
