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UCC3912DP 参数 Datasheet PDF下载

UCC3912DP图片预览
型号: UCC3912DP
PDF下载: 下载PDF文件 查看货源
内容描述: 可编程热插拔电源管理器 [Programmable Hot Swap Power Manager]
分类和应用: 光电二极管信息通信管理
文件页数/大小: 6 页 / 151 K
品牌: TI [ TEXAS INSTRUMENTS ]
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UCC3912  
PIN DESCRIPTIONS  
grammed fault level. When set to logic high, the maxi-  
mum sourcing current will be a constant 4A for  
applications which require fast charging of load capaci-  
tance.  
B0 - B3: These pins provide digital input to the DAC  
which sets the fault current threshold. They can be used  
to provide a digital soft-start, adaptive current limiting.  
CT: A capacitor connected to ground sets the maximum  
fault time. The maximum fault time must be more than  
the time to charge the external capacitance in one cycle.  
The maximum fault time is defined as FAULT = 27.8 103  
CT. Once the fault time is reached the output will shut-  
down for a time given by: TSD = 833 103 CT, this  
equates to a 3% duty cycle.  
SHTDWN: When this pin is brought to a logic low, the IC  
is put into a sleep mode drawing typically less than 1µA  
of ICC. The input threshold is hysteretic, allowing the user  
to program a start-up delay with an external RC circuit.  
VIN: Input voltage to the UCC3912. The recommended  
voltage range is 3 to 8 volts. Both VIN pins should be  
connected together and to the power source.  
FAULT: Open drain output which pulls low upon any con-  
dition which causes the output to open: Fault, Thermal  
Shutdown, or Shutdown.  
VOUT: Output voltage from the UCC3912. When  
switched the output voltage will be approximately VIN -  
(0.15Ω • IOUT). Both VOUT pins should be connected to-  
gether and to the load.  
IMAX: When this pin is set to logic low the maximum  
sourcing current will always be 1A above the pro-  
APPLICATION INFORMATION  
4
12  
13  
5
GND  
HEAT SINK  
GND PINS  
V
V
OUT  
IN  
2
14  
15  
VIN  
VOUT  
R1  
C
R
L
C
OUT  
IN  
3
D1  
UCC3912  
LED  
R
V
SD  
IN  
S6  
16 FAULT  
11 CT  
SHTDWN  
1
C
SD  
B0  
B1  
7
B2  
8
B3 IMAX  
C
T
6
9
5
V
IN  
DIP  
SWITCH  
S1  
S2  
S3  
S4  
S5  
UDG-99171  
Note: For demonstration board schematic see Design Note DN-58.  
Figure 1. Evaluation circuit.  
Reducing the power distribution inductance (e.g., twist  
the “+” and “–” leads of the power supply feeding VIN,  
locate the power supply close to the UCC3912, use a  
PCB ground plane,...etc.).  
Protecting The UCC3912 From Voltage Transients  
The parasitic inductance associated with the power distri-  
bution can cause a voltage spike at VIN if the load current  
is suddenly interrupted by the UCC3912. It is important to  
limit the peak of this spike to less than 8V to prevent  
damage to the UCC3912. This voltage spike can be mini-  
mized by:  
Decoupling VIN with a capacitor, CIN (refer to Fig. 1),  
located close to pins 2 and 3. This capacitor is typically  
less than 1µF to limit the inrush current.  
Clamping the voltage at VIN below 8V with a Zener  
diode, D1(refer to Fig. 1), located close to pins 2 and 3.  
4