TMC603 DATA SHEET (V. 1.06 / 26. Mar. 2009)
9
Pin
VLS
GNDP
VM
GND
RS2G
Hx
FILTx
COSC
SCCLK
BHx
BLx
SAMPLEx
CURx
5VOUT
SP_SUP
VCC
BBM_EN
INV_BL
ENABLE
Number
1, 44
2, 40, 52
3
4, 36
5
6, 7, 8
9, 10, 11
12
13
14, 18,
22
15, 19,
23
16, 20,
24
17, 21,
25
26
27
28
Type
Function
Low side driver supply voltage for driving low side gates
Power GND for MOSFET drivers, connect directly to GND
Motor and MOSFET bridge supply voltage
Digital and analog low power GND
AI 5V
DO 5V
AO 5V
A 5V
DI 5V
DI 5V
DI 5V
DI 5V
AO 5V
Short to GND control resistor. Controls delay time for short to GND
test
hallFX outputs for back EMF based hall sensor emulation
Output of internal switched capacitor filter
Oscillator capacitor for step down regulator
Switched capacitor filter clock input for hallFX filters.
High side driver control signal: A positive level switches on the high
side
Low side driver control signal: Polarity can be reversed via INV_BL
Optional external control for current measurement sample/hold
stage. Set to positive level, if unused
Output of current measurement amplifier
Output of internal 5V linear regulator. Provided for VCC supply
A 5V
An external capacitor on this pin controls the commutation spike
suppression time for hallFX.
+5V supply input for digital I/Os and analog circuitry
Switches current amplifiers to high sensitivity
Enables internal break-before-make circuitry
Allows inversion of BLx input active level (low: BLx is active high)
Enables the power drivers (low: all MOSFETs become actively
switched off)
Error output (open drain). Signals undervoltage or overcurrent. Tie
to ENABLE for direct self protection of the driver
Reset of error flip-flop (active high). Clears error condition
Slope control resistor. Sets output current for MOSFET drivers
Switch regulator transistor output
Test multiplexer output (leave open)
Charge pump supply voltage. Provides high side driver supply
Low side MOSFET driver output
Sensing input for bridge outputs. Used for MOSFET control and
current measurement.
High side MOSFET driver output
Connect the exposed die pad to a GND plane. It is used for cooling
of the IC and may either be left open or be connected to GND.
SENSE_HI 29
30
31
32
DI 5V
DI 5V
DI 5V
DI 5V
DO 5V
DI 5V
AI 5V
O
O 12V
O 12V
I (VM)
O
(VCP)
GND
/ERR_OUT 33
CLR_ERR
RSLP
SWOUT
TEST
VCP
LSx
BMx
HSx
Exposed
die pad
34
35
37
38
39
41, 45,
49
42, 46,
50
43, 47,
51
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TRINAMIC [ TRINAMIC MOTION CONTROL GMBH & CO. KG. ]
