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Single Phase 0.8 AMP Glass Passivated Bridge Rectifiers
MBS
MBS2 - MBS10
Pb
RoHS
COMPLIANCE
Features
UL Recognized File # E-326243
Ideal for printed circuit board
Reliable low cost construction utilizing molded
plastic technique
High surge current capability
High temperature soldering guaranteed:
260℃/10 seconds at 5 lbs., (2.3kg) tension
Small size, simple installation
Green compound with suffix "G" on packing
code & prefix "G" on datecode
Mechanical Data
Case: Molded plastic body
Terminal: Leads solderable
per MIL-STD-202 Method 208
Weight: 0.123 grams
Dimensions in inches and (millimeters)
Marking Diagram
MBSX
G
Y
M
= Specific Device Code
= Green Compound
= Year
= Work Month
Maximum Ratings and Electrical Characteristics
Rating at 25
℃
ambient temperature unless otherwise specified.
Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%
Type Number
Maximum Repetitive Peak Reverse Voltage
Maximum RMS Voltage
Maximum DC Blocking Voltage
Maximum Average Forward Rectified Current
On glass-epoxy P.C.B.
On aluminum substrate
Peak Forward Surge Current, 8.3 ms Single Half Sine-
wave Superimposed on Rated Load (JEDEC method)
Maximum Instantaneous Forward Voltage (Note 1)
@ 0.4A
Maximum DC Reverse Current
at Rated DC Blocking Voltage
(Note 3)
Typical Thermal Resistance (Note 4)
(Note 3)
Operating Temperature Range
Storage Temperature Range
Note 1: Pulse Test with PW=300 usec,1% Duty Cycle
T
A
=25
℃
T
A
=125
℃
Symbol
V
RRM
V
RMS
V
DC
I
F(AV)
MBS2
200
140
200
MBS4
400
280
400
MBS6
600
420
600
0.5
0.8
35
1.00
5
100
13
85
70
20
- 55 to + 150
- 55 to + 150
MBS8
800
560
800
MBS10
1000
700
1000
Unit
V
V
V
A
I
FSM
V
F
I
R
Cj
R
θjA
R
θjA
R
θjL
T
J
T
STG
A
V
uA
pF
O
Typical Junction Capacitance Per Leg (Note 2)
C/W
O
O
C
C
Note 2: Measure at 1.0MHz and Applied Reverse Voltage of 4.0 Volts D.C.
Note 3: On glass epoxy P.C.B. mounted on 0.05" x 0.05" (1.3mm x 1.3mm) pads
Note 4: On aluminum substrate P.C.B. with an area of 0.8" x 0.8" (20mm x 20mm) mounted on 0.05" x 0.05" (1.3mm x 1.3mm) solder pads
Version:H11
TSC [ TAIWAN SEMICONDUCTOR COMPANY, LTD ]
